Features: Avalanche Rugged Technology Rugged Gate Oxide Technology Lower Input CapacitanceImproved Gate Charge Extended Safe Operating Area Lower Leakage Current: 10mA (Max.) @ VDS = 100VLower RDS(ON): 0.101W (Typ.)Specifications Symbol Characteristic Value Units VDSS Drain-to...
IRLR130A: Features: Avalanche Rugged Technology Rugged Gate Oxide Technology Lower Input CapacitanceImproved Gate Charge Extended Safe Operating Area Lower Leakage Current: 10mA (Max.) @ VDS = 100VLower RDS(...
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Features: `Avalanche Rugged Technology`Rugged Gate Oxide Technology `Lower Input Capacitance`Impro...
Features: ·Logic Level Gate Drive·Ultra Low On-Resistance·Surface Mount (IRLR3410)·Straight Lead (...
|
Symbol |
Characteristic |
Value |
Units |
|
VDSS |
Drain-to-Source Voltage |
100 |
V |
|
ID |
Continuous Drain Current (TC=25°C) |
13 |
A |
| Continuous Drain Current (TC=100°C) |
8 | ||
|
IDM |
Drain Current-Pulsed (1) |
45 |
A |
|
VGS |
Gate-to-Source Voltage |
±20 |
V |
|
EAS |
Single Pulsed Avalanche Energy (2) |
225 |
mJ |
|
IAR |
Avalanche Current (1) |
13 |
A |
|
EAR |
Repetitive Avalanche Energy (1) |
4.6 |
mJ |
|
dv/dt |
Peak Diode Recovery dv/dt (2) |
6.5 |
V/ns |
|
PD |
Total Power Dissipation (TA=25°C)* |
2.5 |
W |
| Total Power Dissipation (TC=25°C) Linear Derating Factor |
46 0.37 |
W W/°C | |
|
TJ , TSTG |
Operating Junction and Storage Temperature Range |
- 55 to +150 |
°C |
|
TL |
Maximum Lead Temp. for Soldering Purposes, 1/8 from case for 5-seconds |
300 |