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MFG:IR/FAIRCHILD  Package Cooled:TO-251  D/C:05+  

IRLU2703 Product Image

IRL Series Datasheet download

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Part Number: IRLU2703

 

MFG: IR/FAIRCHILD

Package Cooled: TO-251

D/C: 05+

Description: Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achiev...


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IRLU2703 General Description


Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve the lowest possible on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient device for use in a wide variety of applications.

The D-PAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. The straight lead version (IRFU series) is for through-hole mounting applications. Power dissipation levels up to 1.5 watts are possible in typical surface mount applications.

IRLU2703 Maximum Ratings

Parameter
Max.
Units
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V
23
A
ID @ TC = 100°C
Continuous Drain Current, VGS @ 10V
16
IDM
Pulsed Drain Current
96
PD @TC = 25°C
Power Dissipation
45
W
Linear Derating Factor
0.30
W/°C
VGS
Gate-to-Source Voltage
± 16
V
EAS
Single Pulse Avalanche Energy
77
mJ
IAR
Avalanche Current
14
A
EAR
Repetitive Avalanche Energy
4.5
mJ
dv/dt
Peak Diode Recovery dv/dt
5.0
V/ns
TJ
TSTG
Operating Junction and
Storage Temperature Range
-55 to + 175
°C
Soldering Temperature, for 10 seconds
300 (1.6mm from case )

IRLU2703 Features

· Logic-Level Gate Drive
· Ultra Low On-Resistance
· Surface Mount (IRLR2703)
· Straight Lead (IRLU2703)
· Advanced Process Technology
·Fast Switching
· Fully Avalanche Rated

IRLU2703 datasheet

IRLU2703
PDF/DataSheet Download

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