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MFG:IR/FAIRCHILD  Package Cooled:TO-251  D/C:05+  

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IRL Series Datasheet download

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Part Number: IRLU2905

 

MFG: IR/FAIRCHILD

Package Cooled: TO-251

D/C: 05+

Description: Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achiev...


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IRLU2905 General Description


Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve the lowest possible on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient device for use in a wide variety of applications.

The D-PAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. The straight lead version (IRFU series) is for through-hole mounting applications. Power dissipation levels up to 1.5 watts are possible in typical surface mount applications.

IRLU2905 Maximum Ratings

Parameter Max. Units
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 42 A
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 30
IDM Pulsed Drain Current 160
PD @TC = 25°C C Power Dissipation 110 W
Linear Derating Factor 0.71 W/°C
VGS Gate-to-Source Voltage ±16 V
EAS Single Pulse Avalanche Energy 210 mJ
IAR Avalanche Current 25 A
EAR Repetitive Avalanche Energy 11 mJ
dv/dt Peak Diode Recovery dv/dt 5.0 V/ns
TJ
TSTG		 Operating Junction and 
Storage Temperature Range		 -55 to + 175 °C
Soldering Temperature, for 10 seconds 300 (1.6mm from case )

IRLU2905 datasheet

IRLU2905
PDF/DataSheet Download

Find IRLU2905 Suppliers

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