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MFG:1360


Part Number: IRLU2905Z
MFG: 1360
Description: Specifically designed for Automotive applications, this HEXFET® Power MOSFET utilizes the latest p...
MFG:1360


MFG: 1360
Description: Specifically designed for Automotive applications, this HEXFET® Power MOSFET utilizes the latest p...
Specifically designed for Automotive applications, this HEXFET® Power MOSFET utilizes the latest processing techniques to achieve extremely low on-resistance per silicon area. Additional features of this design are a 175°C junction operating temperature, fast switching speed and improved repetitive avalanche rating . These features combine to make this design an extremely efficient and reliable device for use in Automotive applications and a wide variety of other applications.
| Parameter |
Max. |
Units | |
| ID @ TC = 25°C | Continuous Drain Current, VGS @10V (Silicon Limited) |
60 |
|
| ID @ TC = 100°C | Continuous Drain Current, VGS @10V |
43 |
A |
| ID @ TC = 25°C | Continuous Drain Current, VGS @10V (Silicon Limited) |
42 |
|
| IDM | Pulsed Drain Current |
240 |
|
| PD @TC = 25°C | Power Dissipation |
110 |
W |
| Linear Derating Factor |
0.72 |
W/°C | |
| VGS | Gate-to-Source Voltage |
±16 |
V |
| EAS(Thermally limited) | Single Pulse Avalanche Energy |
57 |
mJ |
| EAS (Tested ) | Single Pulse Avalanche Energy Tested Value |
85 |
|
| IAR | Avalanche Current |
See Fig.12a, 12b, 15, 16 |
A |
| EAR | Repetitive Avalanche Energy |
mJ | |
| TJ TSTG |
Operating Junction and Storage Temperature Range |
-55 to + 175 |
°C |
| Soldering Temperature, for 10 seconds |
300 (1.6mm from case) |
||
| Mounting torque, 6-32 or M3 screw. |
10 lbf•in (1.1N•m) |
IRLU2905Z
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