IRLZ44NL

FET Type: MOSFET N-Channel, Metal Oxide
Transistor Type: -
Current - Collector (Ic) (Max): -
FET Feature: Logic Level Gate
Voltage - Collector Emitter Breakdown (Max): -
Vce Saturation (Max) @ Ib, Ic: -
Current - Collector Cutoff (Max): -
DC Current Gain (hFE) (Min) @ Ic, Vce: -
Frequency - Transition: -
Vgs(th) (Max) @ Id: 2V @ 250µA
Series: HEXFET®
Current - Continuous Drain (Id) @ 25° C: 47A
Packaging: Tube
Mounting Type: Through Hole
Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA
Input Capacitance (Ciss) @ Vds: 1700pF @ 25V
Drain to Source Voltage (Vdss): 55V
Manufacturer: International Rectifier
Gate Charge (Qg) @ Vgs: 48nC @ 5V
Power - Max: 3.8W
Rds On (Max) @ Id, Vgs: 22 mOhm @ 25A, 10V
Supplier Device Package: TO-262


Features:

 Advanced Process Technology
 Surface Mount (IRLZ44NS)
 Low-profile through-hole (IRLZ44NL)
 175°C Operating Temperature
Fast Switching
 Fully Avalanche Rated
Logic-Level Gate Drive


Specifications

	Parameter	Max.	Units
ID @ TC = 25°C	Continuous Drain Current, VGS @ 10V	47	A
ID @ TC = 100°C	Continuous Drain Current, VGS @ 10V	33
IDM	Pulsed Drain Current	160
PD @TC = 25°C	Max. Dissipation	3.8	W
PD @TC = 25°C	Power Dissipation	110	W
	Linear Derating Factor	0.71	W/°C
VGS	Gate-to-Source Voltage	± 16	V
EAS	Single Pulse Avalanche Energy	210	mJ
IAR	Avalanche Current	25	A
EAR	Repetitive Avalanche Energy	11	mJ
dv/dt	Peak Diode Recovery dv/dt	5.0	V/ns
TJ TSTG	Operating Junction and Storage Temperature Range	-55 to + 175	°C
	Soldering Temperature, for 10 seconds	300 (1.6mm from case)

Description

Fifth Generation HEXFETs from International Rectifier IRLZ44NL utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device IRLZ44NL design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The D2Pak IRLZ44NL is a surface mount power package capable of accommodating die sizes up to HEX-4. The IRLZ44NL provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D2Pak IRLZ44NL is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application.

The through-hole version (IRLZ44NL) is available for lowprofile applications.