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MFG:IR  Package Cooled:D2-PAK  D/C:09+  

IRLZ44NS Product Image

IRL Series Datasheet download

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Part Number: IRLZ44NS

 

MFG: IR

Package Cooled: D2-PAK

D/C: 09+

Description: Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achiev...


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IRLZ44NS General Description


Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application.

The through-hole version (IRLZ44NL) is available for lowprofile applications.

IRLZ44NS Maximum Ratings

Parameter
Max.
Units
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V
47
A
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V
33
IDM Pulsed Drain Current
160
PD @TC = 25°C Max. Dissipation
3.8
W
PD @TC = 25°C Power Dissipation
110
W
Linear Derating Factor
0.71
W/°C
VGS Gate-to-Source Voltage
± 16
V
EAS Single Pulse Avalanche Energy
210
mJ
IAR Avalanche Current
25
A
EAR Repetitive Avalanche Energy
11
mJ
dv/dt Peak Diode Recovery dv/dt
5.0
V/ns
TJ
TSTG
Operating Junction and
Storage Temperature Range
-55 to + 175
°C
Soldering Temperature, for 10 seconds
300 (1.6mm from case)

IRLZ44NS Features

 Advanced Process Technology
 Surface Mount (IRLZ44NS)
 Low-profile through-hole (IRLZ44NL)
 175°C Operating Temperature
Fast Switching
 Fully Avalanche Rated
Logic-Level Gate Drive

IRLZ44NS datasheet

IRLZ44NS
PDF/DataSheet Download

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