IRPT2062A

Features: · 3 hp (2.2 kW) power output Industrial rating at 150% overload for 1 minute· 380-480V AC input, 50/60 Hz· 3-phase rectifier bridge· 3-phase, short circuit rated, ultrafast IGBT inverter· HEXFRED ultrafast soft recovery-freewheeling diodes· Brake IGBT and diode· Low inductance (current s...

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SeekIC No. : 004378727 Detail

IRPT2062A: Features: · 3 hp (2.2 kW) power output Industrial rating at 150% overload for 1 minute· 380-480V AC input, 50/60 Hz· 3-phase rectifier bridge· 3-phase, short circuit rated, ultrafast IGBT inverter· ...

floor Price/Ceiling Price

Part Number:
IRPT2062A
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/27

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Product Details

Description



Features:

· 3 hp (2.2 kW) power output
  Industrial rating at 150% overload for 1 minute
· 380-480V AC input, 50/60 Hz
· 3-phase rectifier bridge
· 3-phase, short circuit rated, ultrafast IGBT inverter
· HEXFRED ultrafast soft recovery-freewheeling diodes
· Brake IGBT and diode
· Low inductance (current sense) shunts in positive and negative DC rail
· NTC temperature sensor
· Pin-to-baseplate isolation 2500V rms
· Easy-to-mount two-screw package
· Case temperature range -25°C to 125°C operational



Description

The IRPT2062A Power Module shown in figure 1 is a chip and wire epoxy encapsulated module. It houses input rectifiers, output inverter, current sense shunts and NTC thermistor. The 3-phase input bridge rectifiers are rated at 1600V. The brake circuit uses 1200V IGBT and freewheeling diode. The inverter section employs 1200V, short circuit rated, ultrafast IGBTs and ultrafast freewheeling diodes. Current sensing is achieved through 25 mlow inductance shunts provided in the positive and negative DC bus rail. The NTC thermistor provides temperature sensing capability. The lead spacing on the power module meets UL840 pollution level 3 requirements.

The power circuit and layout within the module are carefully designed to minimize inductance in the power path, to reduce noise during inverter operation and to improve the inverter efficiency. The Driver-Plus Board required to run the inverter can be soldered to the power module pins, thus minimizing assembly and alignment. The power module is designed to be a mounted to a heat sink with two screw mount positions, in order to ensure good thermal contact between the module substrate and the heat sink.




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