Features: • Pin compatible with 128K x 8 devices• High-speed access time: 15, 20, 25, 35 ns• Low active power: 500 mW (typical)• Low standby power- 250 W (typical) CMOS standby• Output Enable (OE) and two Chip Enable(CE1 and CE2) inputs for ease in applications•...
IS61C512: Features: • Pin compatible with 128K x 8 devices• High-speed access time: 15, 20, 25, 35 ns• Low active power: 500 mW (typical)• Low standby power- 250 W (typical) CMOS stand...
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Features: • Internal self-timed write cycle• Individual Byte Write Control and Global ...
Features: • Internal self-timed write cycle• Individual Byte Write Control and Global ...
Features: • Internal self-timed write cycle• Individual Byte Write Control and Global ...
Symbol | Parameter | Value | Unit |
VTERM | Terminal Voltage with Respect to GND | 0.5 to +7.0 | V |
TBIAS | Temperature Under Bias | 10 to +85 | |
TSTG | Storage Temperature | 65 to +150 | |
PT | Power Dissipation | 1.5 | W |
IOUT | DC Output Current (LOW) | 20 | mA |
Notes:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
The ICSI IS61C512 is a very high-speed, low power, 65,536 word by 8-bit CMOS static RAMs. They are fabricated using ICSI's high-performance CMOS technology. This highly reliable process coupled with innovative circuit design techniques, yields higher performance and low power consumption devices.
When CE1 is HIGH or CE2 is LOW (deselected), the device assumes a standby mode at which the power dissipation can be reduced down to 1 mW (typical) with CMOS input levels.
Easy memory expansion is provided by using two Chip Enable inputs, CE1 and CE2. The active LOW Write Enable (WE) controls both writing and reading of the memory.
The IS61C512 is available in 32-pin 300mil DIP, SOJ and 8*20mm TSOP-1 packages.