IS7000

Features: · Options :-10mm lead spread - add G after part no.Surface mount - add SM after part no.Tape&reel - add SMT&R after part no.· High Isolation Voltage (5.3kVRMS ,7.5kVPK )· High Current Transfer Ratio ( 1000% min)· High BVCEO ( 300V min. )Application· Modems· Copiers, facsimiles· N...

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IS7000 Picture
SeekIC No. : 004379310 Detail

IS7000: Features: · Options :-10mm lead spread - add G after part no.Surface mount - add SM after part no.Tape&reel - add SMT&R after part no.· High Isolation Voltage (5.3kVRMS ,7.5kVPK )· High Curr...

floor Price/Ceiling Price

Part Number:
IS7000
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

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Upload time: 2024/4/28

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Product Details

Description



Features:

· Options :-
  10mm lead spread - add G after part no.
  Surface mount - add SM after part no.
  Tape&reel - add SMT&R after part no.
· High Isolation Voltage (5.3kVRMS ,7.5kVPK )
· High Current Transfer Ratio ( 1000% min)
· High BVCEO ( 300V min. )



Application

· Modems
· Copiers, facsimiles
· Numerical control machines
· Signal transmission between systems of different potentials and impedances



Specifications

Storage Temperature.................. -55°C to + 150°C
Operating Temperature............... -55°C to + 100°C
Lead Soldering Temperature
(1/16 inch (1.6mm) from case for 10 secs) ....260°C
INPUT DIODE
Forward Current .............................................50mA
Reverse Voltage...................................................6V
Power Dissipation.......................................... 70mW
OUTPUT TRANSISTOR
Collector-emitter Voltage BVCEO...................... 300V
Emitter-collector Voltage BVECO........................ 0.1V
Collector Current IC...................................... 150mA
Power Dissipation ........................................150mW
POWER DISSIPATION
Total Power Dissipation ...............................200mW



Description

The IS7000 is an optically coupled isolator consisting of infrared light emitting diode and a high voltage NPN silicon photo darlington which has an integral base-emitter resistor to optimise switching speed and elevated temperature characteristics in a space efficient, end-stackable 4 pin dual in line plastic package.




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