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ISP827X

Features: · Options :- 10mm lead spread - add G after part no. Surface mount - add SM after part no.Tape&ree· - add SMT&R after part no.· High Current Transfer Ratio (50% min)· High Isolation Voltage (5.3kVRMS ,7.5kVPK )· High BVCEO ( 35Vmin )· All electrical parameters 100% tested· Custom...

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SeekIC No. : 004381162 Detail

ISP827X: Features: · Options :- 10mm lead spread - add G after part no. Surface mount - add SM after part no.Tape&ree· - add SMT&R after part no.· High Current Transfer Ratio (50% min)· High Isolatio...

ISP827X Data Sheet

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Part Number:
ISP827X
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

· Options :-
  10mm lead spread - add G after part no.
  Surface mount - add SM after part no.
  Tape&ree· - add SMT&R after part no.
· High Current Transfer Ratio (50% min)
· High Isolation Voltage (5.3kVRMS ,7.5kVPK )
· High BVCEO ( 35Vmin )
· All electrical parameters 100% tested
· Custom electrical selections available


Application

·  Computer terminals
·  Industrial systems controllers
·  Measuring instruments
·  Signal transmission between systems of different potentials and impedances


Specifications

Storage Temperature ..................-55°C to + 125°C
Operating Temperature ...............-55°C to + 100°C
Lead Soldering Temperature
(1/16 inch (1.6mm) from case for 10 secs) ....260°C
INPUT DIODE
Forward Current............................................ 50mA
Reverse Voltage................................................. 6V
Power Dissipation .........................................70mW
OUTPUT TRANSISTOR
Collector-emitter Voltage BVCEO .......................35V
Emitter-collector Voltage BVECO.......................... 6V
Power Dissipation .......................................150mW
POWER DISSIPATION
Total Power Dissipation ..............................200mW
(derate linearly 2.67mW/°C above 25°C)


Description

The ISP817, ISP827, ISP847 series of optically coupled isolators consist of infrared light emitting diodes and NPN silicon photo transistors in space efficient dual in line plastic packages.




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