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IXTH 10P60

Features: • International standard package JEDEC TO-247 AD• Low RDS (on) HDMOSTM process• Rugged polysilicon gate cell structure• Unclamped Inductive Switching (UIS) rated• Low package inductance (<5 nH) - easy to drive and to protectApplication• High side sw...

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IXTH 10P60: Features: • International standard package JEDEC TO-247 AD• Low RDS (on) HDMOSTM process• Rugged polysilicon gate cell structure• Unclamped Inductive Switching (UIS) rated...

IXTH 10P60 Data Sheet

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Part Number:
IXTH 10P60
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/28

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Product Details

Description



Features:

• International standard package JEDEC TO-247 AD
• Low RDS (on) HDMOSTM process
• Rugged polysilicon gate cell structure
• Unclamped Inductive Switching (UIS) rated
• Low package inductance (<5 nH) - easy to drive and to protect


Application

• High side switching
• Push-pull amplifiers
• DC choppers
• Automatic test equipment


Specifications

Symbol
Test conditions
Maximum
ratings
VDSS
VDGR
TJ = 25°C to 150°C
TJ = 25°C to 150°C; RGS = 1 M
-600
-600
V
V
VGS
VGSM
Continuous
Transient
±20
±30
V
V
ID25
IDM
IAR
TC = 25°C
TC = 25°C, pulse width limited by TJ
TC = 25°C
-10
-40
-10
A
A
A
EAR
TC = 25°C
35
mJ
PD
TC = 25°C
315
W
TJ
TJM
Tstg
-55 ... +150
150
-55 ... +150
°C
°C
°C
TL
Maximum lead temperature for soldering
1.6 mm (0.062 in.) from case for 10 s
300
°C
Md
Mounting torque
1.13/10
Nm/lb.in.
Weight
6
g



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