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JANTX2N6788U

Features: Surface MountSmall Footprint Alternative to TO-39 PackageHermetically Sealed Dynamic dv/dt Rating Avalanche Energy RatingSimple Drive RequirementsLight WeightSpecifications Parameter IRFE310,JANTX-,JANTXV2N6786U Units Continuous Drain Current ID @ VGS = 10V, TC ...

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SeekIC No. : 004382016 Detail

JANTX2N6788U: Features: Surface MountSmall Footprint Alternative to TO-39 PackageHermetically Sealed Dynamic dv/dt Rating Avalanche Energy RatingSimple Drive RequirementsLight WeightSpecifications Paramete...

JANTX2N6788U Data Sheet

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Part Number:
JANTX2N6788U
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/27

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Product Details

Description



Features:

Surface Mount
Small Footprint
Alternative to TO-39 Package
Hermetically Sealed
Dynamic dv/dt Rating
Avalanche Energy Rating
Simple Drive Requirements
Light Weight


Specifications

Parameter
IRFE310,JANTX-,JANTXV2N6786U
Units
Continuous Drain Current
ID @ VGS = 10V, TC = 25°C
4.5
V
Continuous Drain Current
ID @ VGS = 10V, TC = 100°C
3.0
Pulsed Drain Current Å
IDM
18
Max. Power Dissipation
PD @ TC = 25°±25
14
WmA
Linear Derating Factor
0.11
W/°C
Gate-to-Source Voltage
VGS
±20
V
Single Pulse Avalanche Energy Ç
EAS
7.0
mJmW
Surface Temperature
EAR
300 (for 5 S) stg
V/ns°C
Pckg. Mounting Surface Temp.
dv/dt

5.5
V/ns
Operating Junction
Storage Temperature Range
TJ
TSTG

-55 to 150
o C
Avalanche Current ➀

300 (for 5 S)

Repetitive Avalanche Energy ➀

0.42(typical)
g



Description

The leadless chip carrier (LCC) JANTX2N6788U  package represents the logical next step in the continual evolution of surface mount technology. Desinged to be a close replacement for the TO-39 package, the LCC JANTX2N6788U  will give designers the extra flexibility they need to increase circuit board density. International Rectifier has engineered the LCC JANTX2N6788U package to meet the specific needs of the power market by increasing the size of the bottom source pad, thereby enhancing the thermal and electrical performance. The lid of the package is grounded to the source to reduce RF interference.




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