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JANTX2N6790U

Features: Surface MountSmall FootprintAlternative to TO-39 Package Hermetically Sealed Dynamic dv/dt RatingAvalanche Energy Rating Simple Drive RequirementsLight WeightSpecifications Parameter IRFE310,JANTX-,JANTXV2N6786U Units Continuous Drain Current ID @ VGS = 10V, TC...

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SeekIC No. : 004382019 Detail

JANTX2N6790U: Features: Surface MountSmall FootprintAlternative to TO-39 Package Hermetically Sealed Dynamic dv/dt RatingAvalanche Energy Rating Simple Drive RequirementsLight WeightSpecifications Paramet...

JANTX2N6790U Data Sheet

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Part Number:
JANTX2N6790U
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/27

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Product Details

Description



Features:

Surface Mount
Small Footprint
Alternative to TO-39 Package
Hermetically Sealed
Dynamic dv/dt Rating
Avalanche Energy Rating
Simple Drive Requirements
Light Weight


Specifications

Parameter
IRFE310,JANTX-,JANTXV2N6786U
Units
Continuous Drain Current
ID @ VGS = 10V, TC = 25°C
2.8
V
Continuous Drain Current
ID @ VGS = 10V, TC = 100°C
1.8
Pulsed Drain Current Å
IDM
1811
Max. Power Dissipation
PD @ TC = 25°±25
14
WmA
Linear Derating Factor
0.11
W/°C
Gate-to-Source Voltage
VGS
±20
V
Single Pulse Avalanche Energy Ç
EAS
7.0
mJmW
Surface Temperature
EAR
300 (for 5 S) stg
V/ns°C
Pckg. Mounting Surface Temp.
dv/dt

5.5
V/ns
Operating Junction
Storage Temperature Range
TJ
TSTG

-55 to 150
o C
Avalanche Current ➀

300 (for 5 S)

Repetitive Avalanche Energy ➀

0.42(typical)
g



Description

The leadless chip carrier (LCC) JANTX2N6790U package represents the logical next step in the continual evolution of surface mount technology. Desinged to be a close replacement for the TO-39 package, the LCC JANTX2N6790U will give designers the extra flexibility they need to increase circuit board density. International Rectifier has engineered the LCC JANTX2N6790U package to meet the specific needs of the power market by increasing the size of the bottom source pad, thereby enhancing the thermal and electrical performance. The lid of the package is grounded to the source to reduce RF interference.




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