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MFG:Samsung Electronics  D/C:06+  

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Part Number: K9F5608U0D

 

MFG: Samsung Electronics

 

D/C: 06+

Description: Offered in 32Mx8bit , the K9F5608X0D is 256M bit with spare 8M bit capacity. The device is offered in ...


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K9F5608U0D General Description


Offered in 32Mx8bit , the K9F5608X0D is 256M bit with spare 8M bit capacity. The device is offered in 1.8V, 2.65V, 3.3V Vcc. Its NAND cell provides the most cost-effective solutIon for the solid state mass storage market. A program operation can be performed in typical 200s on a 528-byte page and an erase operation can be performed in typical 2ms on a 16K-byte block. Data in the page can be read out at 50ns cycle time per byte. The I/O pins serve as the ports for address and data input/output as well as command input. The on-chip write control automates all program and erase functions including pulse repetition, where required, and internal verification and margining of data. Even the write-intensive systems can take advantage of the K9F5608X0Ds extended reliability of 100K program/erase cycles by providing ECC(Error Correcting Code) with real time mapping-out algorithm.

The K9F5608X0D is an optimum solution for large nonvolatile storage applications such as solid state file storage and other portable applications requiring non-volatility.

K9F5608U0D Maximum Ratings

Parameter
Symbol
Rating
Unit
Voltage on any pin relative to VSS
VIN/OUT
-0.6 to + 4.6
V
VCC
-0.6 to + 4.6
VCCQ
-0.6 to + 4.6
Temperature Under Bias K9F5608X0D-XCB0
TBIAS
-10 to +125
°C
K9F5608X0D-XIB0
-40 to +125
Storage Temperature K9F5608X0D-XCB0
TSTG
-65 to +150
°C
K9F5608X0D-XIB0
Short Circuit Current

IOS

5
mA

NOTE :
1. Minimum DC voltage is -0.6V on input/output pins. During transitions, this level may undershoot to -2.0V for periods <30ns.Maximum DC voltage on input/output pins is VCC,+0.3V which, during transitions, may overshoot to VCC+2.0V for periods <20ns.
2. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect reliability.

K9F5608U0D Features

• Voltage Supply
   - 1.8V device(K9F5608R0D) : 1.65~1.95V
   - 2.65V device(K9F5608D0D) : 2.4~2.9V
   - 3.3V device(K9F5608U0D) : 2.7 ~ 3.6 V
• Organization
   - Memory Cell Array
   -(32M + 1024K)bit x 8 bit
   - Data Register
   - (512 + 16)bit x 8bit
• Automatic Program and Erase
   - Page Program
   -(512 + 16)Byte
   - Block Erase :
   - (16K + 512)Byte
• Page Read Operation
   - Page Size
   - (512 + 16)Byte
   - Random Access : 15s(Max.)
   - Serial Page Access : 50ns(Min.)
• Fast Write Cycle Time
   - Program time : 200s(Typ.)
   - Block Erase Time : 2ms(Typ.)
• Command/Address/Data Multiplexed I/O Port
• Hardware Data Protection
   - Program/Erase Lockout During Power Transitions
• Reliable CMOS Floating-Gate Technology
   - Endurance        : 100K Program/Erase Cycles
   - Data Retention : 10 Years
• Command Register Operation
• Intelligent Copy-Back
• Unique ID for Copyright Protection
• Package
   - K9F5608D(U)0D-PCB0/PIB0
     48 - Pin TSOP I (12 x 20 / 0.5 mm pitch)- Pb-free Package
   - K9F5608X0D-JCB0/JIB0
     63- Ball FBGA ( 9 x 11 /0.8mm pitch , Width 1.0 mm)
   - Pb-free Package
   - K9F5608U0D-FCB0/FIB0
     48 - Pin WSOP I (12X17X0.7mm)- Pb-free Package
* K9F5608U0D-F(WSOPI ) is the same device as K9F5608U0D-P(TSOP1) except package type.

K9F5608U0D Connection Diagram

K9F5608U0D  Connection Diagram

K9F5608U0D datasheet

K9F5608U0D-XCB0
PDF/DataSheet Download

  • Datasheet: K9F5608U0D-XCB0
  • File Size: 880706 KB
  • Manufacturer: SAMSUNG [Samsung semiconductor]
  • Click here to Download

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