KAB0xD100M - TxGP

Features: Power Supply Voltage : 2.7V~3.1V Organization - NOR Flash : 8,388,608 x 8 bit / 4,194,304 x 16 bit - NAND Flash : (8M + 256K)bit x 16bit - UtRAM : 2Mbit x 16 bit Access Time - NOR Flash : 70ns(Max.) - NAND Flash : Random : 10us(Max.), Serial : 50ns(Min.) - UtRAM : 85ns ...

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KAB0xD100M - TxGP Picture
SeekIC No. : 004383847 Detail

KAB0xD100M - TxGP: Features: Power Supply Voltage : 2.7V~3.1V Organization - NOR Flash : 8,388,608 x 8 bit / 4,194,304 x 16 bit - NAND Flash : (8M + 256K)bit x 16bit - UtRAM : 2Mbit x 16 bit Access Time -...

floor Price/Ceiling Price

Part Number:
KAB0xD100M - TxGP
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/27

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Product Details

Description



Features:

Power Supply Voltage : 2.7V~3.1V
Organization
   - NOR Flash : 8,388,608 x 8 bit / 4,194,304 x 16 bit
   - NAND Flash : (8M + 256K)bit x 16bit
   - UtRAM : 2Mbit x 16 bit
Access Time
   - NOR Flash : 70ns(Max.)
   - NAND Flash : Random : 10us(Max.), Serial : 50ns(Min.)
   - UtRAM : 85ns
Power Consumption (typical value)
   - NOR Flash Read Current : 14mA (@5MHz)
               Program/Erase Current : 15mA
               Read while Program or Read while Erase : 35mA
               Standby Mode/Autosleep Mode : 10µA
   - NAND Flash Read Current : 10mA(@20MHz)
               Program/Erase Current : 10mA
               Standby Current : 10µA
   - UtRAM Operating Current : 30mA
               Standby Current : 80µA
 NOR Flash Secode(Security Code) Block : Extra 64KB Block
 NOR Flash Block Group Protection / Unprotection
 NOR Flash Bank Size : 16Mb / 48Mb , 32Mb / 32Mb
NAND Flash Automatic Program and Erase
   Page Program: (256 + 8)Word, Block Erase: (8K + 256)Word
  NAND Flash Fast Write Cycle Time
   Program time : 200µs(Typ.)
   Block Erase Time : 2ms(Typ.)
  Endurance
   NOR : 100,000 Program/Erase Cycles Minimum
   NAND : 100,000 Program/Erase Cycles Minimum with ECC
             : 1,000 Program/Erase Cycles Maximum without ECC
  Data Retention : 10 years
  Operating Temperature : -25°C ~ 85°C
Package : 80 - Ball TBGA Type - 8 x 12mm, 0.8 mm pitch



Specifications

Parameter
Symbol
Rating
Unit
Voltage on any pin relative to VSS
Vcc
VccR,VccF,VccU,VccQU
-0.2 to Vcc+0.3
V
RESET
VIN
-0.2 to 12.5V
wp /ACC
-0.2 to 12.5V
Other Balls
-0.2 to 3.6V
Temperature Under Bias
TBIAS
-40 to + 125
Storage Temperature
TSTG
-65 to + 150
Operating Temperature
TA
-25 to + 85



Description

The KAB0xD100M featuring single 3.0V power supply is a Multi Chip Package Memory which combines 64Mbit NOR Flash, 128Mbit NAND Flash and 32Mbit Unit Transistor CMOS RAM. 64Mbit NOR Flash memory is organized as 8M x8 or 4M x16 bit,128Mbit NAND Flash memory is organized as 8M x16 bit and 32Mbit UtRAM is organized as 2M x16 bit. The memory architecture of NOR Flash memory is designed to divide its memory arrays into 135 blocks and this provides highly flexible erase and program capability. This device is capable of reading data from one bank while programming or erasing in the other bank with dual bank organization. NOR Flash memory performs a program operation in units of 8 bits (Byte) or 16 bits (Word) and erases in units of a block. Single or multiple blocks can be erased. The block erase operation is completed for typically 0.7sec.

In 128Mbit NAND Flash a 256-word page program can be typically achieved within 200µs and an 8K-word block erase can be typically achieved within 2ms. In serial read operation, a byte can be read by 50ns. DQ pins serve as the ports for address and data input/output as well as command inputs. The KAB0xD100M is suitable for the memory of mobile communication system to reduce not only mount area but also power consumption. This device is available in 80-ball TBGA package.


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