KAF-1602E

Features: `1.6M Pixel Area CCD`1536H x 1024V (9 m) Pixels`13.8 mm H x 9.2 mm V Photosensitive Area`2-Phase Register Clocking`Enhanced Responsivity`100% Fill Factor`High Output Sensitivity (10V/e-)`Low Dark Current (<10pA/cm2 @ 25)PinoutSpecifications Description Symbol Min. Max....

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KAF-1602E Picture
SeekIC No. : 004383901 Detail

KAF-1602E: Features: `1.6M Pixel Area CCD`1536H x 1024V (9 m) Pixels`13.8 mm H x 9.2 mm V Photosensitive Area`2-Phase Register Clocking`Enhanced Responsivity`100% Fill Factor`High Output Sensitivity (10V/e-)`L...

floor Price/Ceiling Price

Part Number:
KAF-1602E
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/18

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Product Details

Description



Features:

`1.6M Pixel Area CCD
`1536H x 1024V (9 m) Pixels
`13.8 mm H x 9.2 mm V Photosensitive Area
`2-Phase Register Clocking
`Enhanced Responsivity
`100% Fill Factor
`High Output Sensitivity (10V/e-)
`Low Dark Current (<10pA/cm2 @ 25)



Pinout

  Connection Diagram


Specifications

Description
Symbol
Min.
Max.
Units
Notes
Diode Pin Voltages
Vdiode
0
20
V
1, 2
Gate Pin Voltages - Type 1
Vgate1
-16
16
V
1, 3
Gate Pin Voltages - Type 2
Vgate2
0
16
V
1, 4
Inter-Gate Voltages
Vg-g
16
V
5
Output Bias Current
Iout
-10
mA
6
Output Load Capacitance
Cload
15
pF
6
Storage Temperature
T
100
Humidity
RH
5
90
%
7
Notes:
1. Referenced to pin VSUB.
2. Includes pins: VRD, VDD, VSS, VOUT.
3. Includes pins: V1, V2, H1, H2.
4. Includes pins: R, VOG.
5. Voltage difference between overlapping gates. Includes: V1 to V2, H1 to H2, V2 to H1, H2 to VOG.
6. Avoid shorting output pins to ground or any low impedance source during operation.
7. T=25°C. Excessive humidity will degrade MTTF.



Description

The KAF-1602 is a high performance monochrome area CD (charge-coupled device) image sensor with 1536H  1024V photoactive pixels designed for a wide range  f image sensing applications in the 0.4nm to 1.0nm avelength band. Typical applications include military, cientific, and industrial imaging. A 74dB dynamic ange is possible operating at room temperature. he sensor is built with a true two-phase CCD echnology employing a transparent gate. This echnology simplifies the support circuits that drive the ensor and reduces the dark current without ompromising charge capacity.

The transparent gate results in spectral response ncreased ten times at 400nm, compared to a front side lluminated standard poly silicon gate technology. The ensitivity is increased 50% over the rest of the visible avelengths.

Total chip size is 13.8mm x 9.2mm and is housed in a 4-pin, 0.88" wide DIL ceramic package with 0.1" pin pacing.

The sensor consists of 1552 parallel (vertical) CCD hift registers each 1032 elements long. These registers ct as both the photosensitive elements and as the ransport circuits that allow the image to be sequentially ead out of the sensor. The elements of these registers re arranged into a 1536 x 1024 photosensitive array urrounded by a light shielded dark reference of 16 olumns and 8 rows. The parallel (vertical) CCD egisters transfer the image one line at a time into a ingle 1564 element (horizontal) CCD shift register.

The horizontal register transfers the charge to a single utput amplifier. The output amplifier is a two-stage ource follower that converts the photogenerated charge o a voltage for each pixel.




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