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KB357NT

Features: 1.Opaque type,mini-flat package.2.Subminiature type(The volume is smaller than that of our conventional DIP type by as far as 30%).3.Isolation voltage between input and output Viso:3750Vrms.4.Employs double transfer mold technology.5.Recognized by UL and CUL, file NO.E225308.6.Package: 1...

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SeekIC No. : 004384119 Detail

KB357NT: Features: 1.Opaque type,mini-flat package.2.Subminiature type(The volume is smaller than that of our conventional DIP type by as far as 30%).3.Isolation voltage between input and output Viso:3750Vrm...

KB357NT Data Sheet

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Part Number:
KB357NT
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/24

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Product Details

Description



Features:

1.Opaque type,mini-flat package.
2.Subminiature type(The volume is smaller than that of our conventional DIP type by as far as 30%).
3.Isolation voltage between input and output Viso:3750Vrms.
4.Employs double transfer mold technology.
5.Recognized by UL and CUL, file NO.E225308.
6.Package: 1000Pcs / Reel.
7.RoHS Compliant.


Application

1.Hybrid substrates that require high density mounting.
2.Programmable controllers.


Specifications

Parameter
Symbol
Rating
Unit
Input
 Forward current
IF
50
mA
Reverse Voltage
VR
6
V
Power dissipation
P
70
mW
Output
 Collector-emitter voltage
VCEO
35
V
Emitter-collector voltage
VECO
6
V
Collector current
IC
50
mA
Collector power dissipation
PC
150
mW
Total power dissipation
Ptot
170
mW
*1 Isolation voltage
Viso
3750
Vrms
Operating temperature
Topr
-30 to +100
°C
Storage temperature
Tstg
-40 to +125
°C
*2 Soldering temperature
Tsol
260
°C

*1 40 to 60%RH, AC for1 minute.
*2 For 10 seconds.


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