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KBJ10M

Features: · Diffused Junction·Low Forward Voltage Drop· High Current Capability· High Reliability·High Surge Current Capability ·Ideal for Printed Circuit BoardsSpecifications Characteristic Symbol KBJ10A KBJ10B KBJ10D KBJ10G KBJ10J KBJ10K KBJ10M Unit Peak Repe...

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SeekIC No. : 004384198 Detail

KBJ10M: Features: · Diffused Junction·Low Forward Voltage Drop· High Current Capability· High Reliability·High Surge Current Capability ·Ideal for Printed Circuit BoardsSpecifications Characteristic ...

KBJ10M Data Sheet

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Part Number:
KBJ10M
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/26

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Product Details

Description



Features:

· Diffused Junction
· Low Forward Voltage Drop 
· High Current Capability 
· High Reliability
· High Surge Current Capability
·Ideal for Printed Circuit Boards


Specifications

Characteristic
Symbol
KBJ10A
KBJ10B
KBJ10D
KBJ10G
KBJ10J
KBJ10K
KBJ10M
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
50
100
200
400
600
800
1000
V
RMS Reverse Voltage
VR(RMS)
35
70
140
280
420
560
700
V
Average Rectified Output Current @TC = 100°C
@TA = 25°C
IO
10
3.0
A
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave superimposed on
rated load (JEDEC Method)
IFSM
170
A
I2t Rating for Fusing (t < 8.35ms)
I2t
120
A2s
Forward Voltage (per diode) @IF = 5.0A
VFM
1.05
V
Peak Reverse Current @TA = 25°C
At Rated DC Blocking Voltage @TC = 100°C
IR
170
A
Typical Thermal Resistance (Note 1)
RJC
2.5
°C/W
Operating and Storage Temperature Range
Tj,TSTG
-55 to +150
°C


Note: 1. Thermal resistance junction to case, mounted on 150 x 150 x 1.6mm thick Cu plate heatsink.




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