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KBP150G

Features: Glass Passivated Die ConstructionLow Forward Voltage Drop High Current Capability High ReliabilityHigh Surge Current Capability Ideal for Printed Circuit BoardsSpecifications Characteristic Symbol KBP150G KBP151G KBP152G KBP154G KBP156G KBP158G KBP1510G ...

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KBP150G: Features: Glass Passivated Die ConstructionLow Forward Voltage Drop High Current Capability High ReliabilityHigh Surge Current Capability Ideal for Printed Circuit BoardsSpecifications Char...

KBP150G Data Sheet

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Part Number:
KBP150G
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/28

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Product Details

Description



Features:

 Glass Passivated Die Construction
 Low Forward Voltage Drop 
High Current Capability
High Reliability
 High Surge Current Capability
Ideal for Printed Circuit Boards


Specifications

Characteristic
Symbol
KBP
150G
KBP
151G
KBP
152G
KBP
154G
KBP
156G
KBP
158G
KBP
1510G
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
50
100
200
400
600
800
1000
V
RMS Reverse Voltage
VR(RMS)
35
70
140
280
420
560
700
V
Average Rectified Output Current
@TA = 50°C
IO
10
A
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave superimposed on
rated load (JEDEC Method)
IFSM
50
A
Forward Voltage (per diode) @IF = 1.5A
VFM
1.1
V
TPeak Reverse Current @TA = 25°C
At Rated DC Blocking Voltage @TA = 100°C
IRM
10
500
A
Rating for Fusing (t<8.3ms)
I2t
10
A2s
Typical Thermal Resistance
CJ
15
pF
Typical Thermal Resistance (Note 2)
RJA
28
K/W
Operating and Storage Temperature Range
Tj,TSTG
-65 to +150

°C

Note: 1. Leads maintained at ambient temperature at a distance of 9.5mm from the case.
2. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C.
3. Thermal resistance junction to ambient mounted on PC board with 12mm2 copper pad.


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