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Part Number: KM416RD8AC(D)

 

 

 

 

Description: Figure 2 is a block diagram of the 128/144 Mbit Direct RDRAM. It consists of two major blocks: a "core" block built fro...


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KM416RD8AC(D) General Description


Figure 2 is a block diagram of the 128/144 Mbit Direct RDRAM. It consists of two major blocks: a "core" block built from banks and sense amps similar to those found in other types of DRAM, and a Direct Rambus interface block which permits an external controller to access this core at up to 1.6GB/s.

KM416RD8AC(D) Maximum Ratings

Symbol Parameter Min Max Unit
VI,ABS Voltage applied to any RSL or CMOS pin with respect to Gnd - 0.3 VDD+0.3 V
VDD,ABS, VDDA,ABS Voltage on VDD and VDDA with respect to Gnd - 0.5 VDD+1.0 V
TSTORE Storage temperature - 50 100 °C

KM416RD8AC(D) Features

¨ Highest sustained bandwidth per DRAM device
      - 1.6GB/s sustained data transfer rate
      - Separate control and data buses for maximized efficiency
      - Separate row and column control buses for easy scheduling and highest performance
      - 32 banks: four transactions can take place simultaneously at full bandwidth data rates
¨ Low latency features
      - Write buffer to reduce read latency
      - 3 precharge mechanisms for controller flexibility
      - Interleaved transactions
¨ Advanced power management:
     - Direct RDRAM operates from a 2.5 volt supply
     - Multiple low power states allows flexibility in power consumption versus time to transition to active state
     - Power-down self-refresh
¨ Organization: 1Kbyte pages and 32 banks, x 16/18
     - x18 organization allows ECC configurations or increased storage/bandwidth
     - x16 organization for low cost applications
¨ Uses Rambus Signaling Level (RSL) for up to 800MHz operation

KM416RD8AC(D) datasheet

KM416RD8AC(D)-RK70
PDF/DataSheet Download

  • Datasheet: KM416RD8AC(D)-RK70
  • File Size: 4149446 KB
  • Manufacturer: SAMSUNG [Samsung semiconductor]
  • Click here to Download

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