MFG:SAMSUNG Package Cooled:DIP-28 D/C:03+
MFG: SAMSUNG
Package Cooled: DIP-28
D/C: 03+
Description: The KM6264B family is fabricated by SAMSUNG's advanced CMOS process technology. The family can support...
The KM6264B family is fabricated by SAMSUNG's advanced CMOS process technology. The family can support various operating temperature ranges and has various package types for user flexibility of system design. The family also support low data retention voltage for battery back-up operations with low data retention current.
|
Item |
Symbol |
Ratings |
Unit |
Remark |
| Voltage on any pin relative to Vss |
Vin, Vout |
-0.5 to Vcc+0.5 |
V |
- |
| Voltage on Vcc supply relative to Vss |
Vcc |
-0.5 to 7.0 |
V |
- |
| Power Dissipation |
Pd |
1.0 |
W |
- |
| Storage temperature |
Tstg |
-65 to 150 |
- | |
| Operating Temperature |
Ta |
0 to 70 |
KM6264BL/L-L | |
|
-25 to 85 |
KM6264BLE/LE-L | |||
|
-40 to 85 |
KM6264BLI/LI-L | |||
| Soldering temperature and time |
Tsolder |
260, 10sec(Lead Only) |
- |
- |
KM6264BLP-7
PDF/DataSheet Download
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