LMV324QUAD

Supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5.5 V
Differential input voltage, VID (see Note 2)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±5.5 V
Input voltage, VI (either input)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0 to 5.5 V
Duration of output short circuit (one amplifier) to ground at (or below) T_A = 25,
VCC 3 5.5 V (see Note 3)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. Unlimited
Operating virtual junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . .150
Package thermal impedance, qJA (see Notes 4 and 5): D (8-pin) package  . . .  . .197/W
                                                                                      D (14-pin) package  . . . ..127/W
                                                                                      DBV package  . . . . . . . .  .347/W
                                                                                      DCK package  . . . . . . . .  .389/W
                                                                                      PW (8-pin) package  . . .. .243/W
                                                                                      PW (14-pin) package  . .  . 170/W
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: D or PW package  . 260
                                                                                                      DBV or DCK package  TBD
Storage temperature range, T_stg  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...65 to 150
† Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values (except differential voltages and VCC specified for the measurement of IOS) are with respect to the network GND.
2. Differential voltages are at IN+ with respect to IN.
3. Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
4. Maximum power dissipation is a function of TJ(max), JA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is P_D = (TJ(max) T_A)/JA. Selecting the maximum of 150 can impact reliability.
5. The package thermal impedance is calculated in accordance with JESD 51.