LP3929

If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/  istributors for availability and specifications.
Supply Voltage (V_BAT)                                      −0.3V to +6.0V
Supply Voltage (V_DDA)                                     −0.3V to +3.3V
LVCMOS A Port Input Voltage                          −0.3V to V_DDA + 0.3V
LVCMOS A Port I/O Voltage                              −0.3V to V_DDA + 0.3V
LVCMOS A Port I/O Voltage                              −0.3V to V_DDB + 0.3V
Junction Temperature                                      150
Storage Temperature                                       −65 to +150
Lead Temperature (Note 13)                           235
Pad Temperature (Note 13)                             235
Derate micro SMD
Package above 25                                        22.9 mW/
Maximum Power Dissipation Capacity at 25
micro SMD                                                        2.8 W
ESD Rating
HBM, 1.5k, 100pF                                          ± 2kV
EIAJ, 0, 200pF                                               ± 200V
IEC61000-4-2, 330, 150pF,
Air Gap, B Side (Note 2)                                   ± 15kV
IEC61000-4-2, 330, 150pF,
Direct Contact, B Side (Note 2)                        ± 8kV

The LP3929 is designed for portable and wireless applications requiring level translation and power supply generation in a compact footprint.

The LP3929 level translates 1.8 V LVCMOS on the host (A) side to 2.85 V LVCMOS levels on the card (B) side for a miniSD / SD 4-bit bi-directional data bus.

Independent direct control of the CMD, Data0 and Data1-3 paths support mini SD state machine requirements. A shutdown pin is provided for the level shifters and regulator. The f_CLK_A is a feedback clock to the host which can be used to overcome level shifter bus delay.

The built-in low-dropout voltage regulator is ideal for mobile phone and battery powered wireless applications. It provides up to 200 mA from a 3.05 V to 5.5 V input. It is stable with small 1.0 F ±30% ceramic and high quality tantalum output capacitors, requiring smallest possible PC board area.

The card (B port) side channels have integration of ASIP (Application Specific Integrated Passives) - on chip integrated pull-up, pull-down, series resistors and capacitors for EMC filtering. It is designed to tolerate IEC61000-4-2 level 4 ESD: ±15 kV air discharge, ±8 kV direct contact.