LSC3X00

LSC3X00 laser modules are high reliability fiber optic light sources operating in the 1300 nanometer band. They are particularly well suited for applications where low power dissipation is required.

The internal semiconductor lasers are based upon InGaAsP buried heterostructure (BH) technology and fabricated by the Metal- Organic Vapor Phase Epitaxy (MOVPE) process, resulting in long lifetimes and modest threshold currents.

The LSC3X00 package includes a photodiode for monitoring the laser output. A longhorn type heatsink mounting flange is incorporated in the industry standard 14 pin DIL package.

Two basic varieties are offered for alternative power ranges. The "low power" LSC3300 covers the power range between 100 mW and 625 mW.The "high power" LSC3100 uses the same laser chip, but with tighter fiber coupling to achieve output powers from 1 mW to 2.5 mW.

The low cost outer package is made feasible by our unique design of hermetic miniature laser submodule which houses the electro-optic devices. The submodule concept is used as a building block in many other Hewlett-Packard products including cooled 1 mW 14 pin lasers and DFB modules.