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Package Cooled:PLCC  

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Part Number: M27C256B

 

 

Package Cooled: PLCC

 

Description: The FDIP28W (window ceramic frit-seal package)has a transparent lid which allows the user to ex-pose t...


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M27C256B General Description


The FDIP28W (window ceramic frit-seal package)has a transparent lid which allows the user to ex-pose the chip to ultraviolet light to erase the bit pat-tern. A new pattern can then be written to the device by following the programming procedure.

For applications where the content is programmed only one time and erasure is not required, the M27C256B is offered in PDIP28, PLCC32 andTSOP28 (8 x 13.4 mm) packages.

M27C256B Maximum Ratings

Symbol Parameter Value Unit
TA Ambient Operating Temperature (3) 40 to 125 °C
TBIAS Temperature Under Bias 50 to 125 °C
TSTG Storage Temperature 65 to 150 °C
VIO (2) Input or Output Voltage (except A9) 2 to 7 V
VCC Supply Voltage 2 to 7 V
VA9 (2) A9 Voltage 2 to 13.5 V
VPP Program Supply Voltage 2 to 14 V

M27C256B Connection Diagram

M27C256B  Connection DiagramM27C256B  Connection DiagramM27C256B  Connection Diagram

M27C256B datasheet

M27C256B
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