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Part Number: M312L5720BG0-CB3

 

 

 

 

 

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M312L5720BG0-CB3 Maximum Ratings



Parameter
Symbol
Value
Unit
Voltage on any pin relative to Vss VIN, VOUT
-0.5 ~ 3.6
V
Voltage on VDD supply relative to Vss VDD,VDDQ
-1.0 ~ 3.6
V
Storage temperature TSTG

-55 ~ +150

Power dissipation PD
1.5 * # of component
W
Short circuit current

IOS

50

mA

Note :
Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded.
Functional operation should be restricted to recommended operating condition.
Exposure to higher than recommended voltage for extended periods of time could affect device reliability.

M312L5720BG0-CB3 Features

• Power supply : Vdd: 2.5V ± 0.2V, Vddq: 2.5V ± 0.2V
• Double-data-rate architecture; two data transfers per clock cycle
• Bidirectional data strobe(DQS)
• Differential clock inputs(CK and CK)
• DLL aligns DQ and DQS transition with CK transition
• Programmable Read latency 2, 2.5 (clock)
• Programmable Burst length (2, 4, 8)
• Programmable Burst type (sequential & interleave)
• Edge aligned data output, center aligned data input
• Auto & Self refresh, 7.8us refresh interval(8K/64ms refresh)
• Serial presence detect with EEPROM

M312L5720BG0-CB3 datasheet

M312L5720BG0-CB3
PDF/DataSheet Download

  • Datasheet: M312L5720BG0-CB3
  • File Size: 281003 KB
  • Manufacturer: SAMSUNG [Samsung semiconductor]
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