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M38K09F8HP
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MFG:MITSUBISHI Package Cooled:QFP D/C:08+

M38 Series Datasheet download

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Part Number: M38K09F8HP

MFG: MITSUBISHI

Package Cooled: QFP

D/C: 08+

Description: The 38K0 group is the 8-bit microcomputer based on the 740 family core technology.The 38K0 group has the USB fu...

M38K09F8HP General Description

The 38K0 group is the 8-bit microcomputer based on the 740 family core technology.

The 38K0 group has the USB function, an 8-bit bus interface, a Serial I/O, three 8-bit timers, and an 8-channel 10-bit A-D converter, which are available for the PC peripheral I/O device.

The various microcomputers in the 38K0 group include variations of internal memory size and packaging. For details, refer to the section on part numbering.

M38K09F8HP Maximum Ratings

Symbol	Parameter		Conditions	Ratings	Unit
V_CC	Power source voltage		All voltages are based on VSS. Output transistors are cut off.	0.3 to 6.5	V
AV_CC	Analog power source voltage V_CCE, V_REF, PV_CC, DV_CC, USBV_REF			0.3 to V_CC + 0.3	V
V_I	Input voltage P0₀P0₇, P1₀P1₇, P2₀P2₇, P3₀ P3₇, P4₀P4₃, P5₀P5₇, P6₀P6₃			0.3 to V_CC + 0.3	V
V_I	Input voltage RESET, X_IN, CNV_SS2			0.3 to V_CC + 0.3	V
V_I	Input voltage CNV_SS	Mask ROM version		0.3 to V_CC + 0.3	V
V_I	Input voltage CNV_SS	Flash memory version		0.3 to 6.5	V
V_I	Input voltage D0+, D0-			0.5 to 3.8	V
V_O	Output voltage P0₀P0₇, P1₀P1₇, P2₀P2₇, P3₀ P3₇, P4₀P4₃, P5₀P5₇, P6₀P6₃,X_OUT			0.3 to V_CC + 0.3	V
V_O	Output voltage D0+, D0-, TrON			0.5 to 3.8	V
P_d	Power dissipation (Note)		Ta = 25°C	500	mW
T_opr	Operating temperature		MCU operating	20 to 85	°C
T_opr	Operating temperature		In flash memory mode (For flash memory version)	25±5	°C
T_stg	Storage temperature			40 to 125	°C

Note: The maximum rating value depends on not only the MCU's power dissipation but the heat consumption characteristics of the package.

M38K09F8HP Features

•Basic machine-language instructions ....................................... 71
•The minimum instruction execution time .......................... 0.25 s (at 8 MHz system clock*)
System clock*: Reference frequency to internal circuit except USB function
•Memory size
ROM ................................................................ 16 K to 32 K bytes
RAM ............................................................... 1024 to 2048 bytes
•Programmable input/output ports ............................................. 48
•Software pull-up resistors
•Interrupts .................................................. 15 sources, 15 vectors
•USB function (USB version 1.1 specification) ........... 4 endpoints
•External bus interface ....................................... 8-bit * 1 channel
•Timers ............................................................................. 8-bit * 3
•Watchdog timer ............................................................. 16-bit *1
•Serial I/O ...................... 8-bit *1 (UART or Clock-synchronized)
•A-D converter ................................................ 10-bit *8 channels (8-bit reading available)
•LED direct drive port ................................................................... 4
•Clock generating circuit (connect to external ceramic resonator or quartz-crystal oscillator)
•Power source voltage
System clock/Internal clock division mode
    At 12 MHz/Through mode ( = 12 MHz) ................ 4.50 to 5.25 V (under planning)
    At 12 MHz/2-divide mode( = 6 MHz) ................... 4.00 to 5.25 V (under development)
    At 8 MHz/Through mode ( = 8 MHz) ................... 4.00 to 5.25 V
    At 6 MHz/Through mode ( = 6 MHz) ................... 4.00 to 5.25 V
    At 6 MHz/Through mode ( = 6 MHz) ................... 3.00 to 4.00 V (under development)
Remarks: The mode under development will be available from Aug./2002.
•Power dissipation
At 5 V power source voltage .................................. 125 mW (typ.) (at 8 MHz system clock, in through mode)
At 3.3 V power source voltage ................................ 45 mW (typ.) (at 6 MHz system clock, in through mode)
•Operating temperature range .................................... 20 to 85°C
•Packages
FP ........................................ 64P6U-A (64-pin 14 *14 mm LQFP)
HP ........................................ 64P6Q-A (64-pin 10 *10 mm LQFP)

M38K09F8HP Connection Diagram

M38K09F8HP datasheet

M38000E1-XXXFP
PDF/DataSheet Download

Datasheet: M38000E1-XXXFP
File Size: 2447095 KB
Manufacturer: MITSUBISHI [Mitsubishi Electric Semiconductor]
Click here to Download

·M38000E1-XXXFS
MITSUBISHI [Mitsubishi Electric Semiconductor]
8-BIT SINGLE-CHIP MICROCOMPUTER
4303892 KB
·M38000E1-XXXHP
MITSUBISHI [Mitsubishi Electric Semiconductor]
8-BIT SINGLE-CHIP MICROCOMPUTER
4303892 KB
·M38000E1-XXXSP
MITSUBISHI [Mitsubishi Electric Semiconductor]
8-BIT SINGLE-CHIP MICROCOMPUTER
4303892 KB
·M38000E1-XXXSS
MITSUBISHI [Mitsubishi Electric Semiconductor]
8-BIT SINGLE-CHIP MICROCOMPUTER
4303892 KB
·M38000E2-XXXFP
MITSUBISHI [Mitsubishi Electric Semiconductor]
8-BIT SINGLE-CHIP MICROCOMPUTER
2447095 KB
·M38000E2-XXXFS
MITSUBISHI [Mitsubishi Electric Semiconductor]
8-BIT SINGLE-CHIP MICROCOMPUTER
2447095 KB
·M38000E2-XXXHP
MITSUBISHI [Mitsubishi Electric Semiconductor]
8-BIT SINGLE-CHIP MICROCOMPUTER
4303892 KB
·M38000E2-XXXSP
MITSUBISHI [Mitsubishi Electric Semiconductor]
8-BIT SINGLE-CHIP MICROCOMPUTER
4303892 KB

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M38K07M4-XXXHP
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