Purchase M393T6453FG(Z)3-CD5, In-stock M393T6453FG(Z)3-CD5 From SeekIC, PDF Datasheet Download.

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M393T6453FG(Z)3-CD5
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Maximum Ratings

Symbol	Parameter	Rating	Units	Notes
V_DD	Voltage on V_DD pin relative to V_SS	- 1.0 V ~ 2.3 V	V	1
V_DDQ	Voltage on V_DDQ supply relative to Vss	- 0.5 V ~ 2.3 V	V	1
V_DDL	Voltage on V_DDL pin relative to V_SS	- 0.5 V ~ 2.3 V	V	1
V_IN, V_OUT	Voltage on any pin relative to V_SS	- 0.5 V ~ 2.3 V	V	1
T_STG	Storage Temperature	-55 to +100	℃	1,2

Note :
1. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
2. Storage Temperature is the case surface temperature on the center/top side of the DRAM. For the measurement conditions, please refer to JESD51-2 standard.

Features

• Performance range
• JEDEC standard 1.8V ± 0.1V Power Supply
• V_DDQ = 1.8V ± 0.1V
• 200 MHz f_CK for 400Mb/sec/pin, 267MHz f_CK for 533Mb/sec/pin, 333MHz f_CK for 667Mb/sec/pin
• 4 Banks
• Posted CAS
• Programmable CASLatency: 3, 4, 5
• Programmable Additive Latency: 0, 1 , 2 , 3 and 4
• Write Latency(WL) = Read Latency(RL) -1
• Burst Length: 4 , 8(Interleave/nibble sequential)
• Programmable Sequential / Interleave Burst Mode
• Bi-directional Differential Data-Strobe (Single-ended data-strobe is an optional feature)
• Off-Chip Driver(OCD) Impedance Adjustment
• On Die Termination
• Average Refresh Period 7.8us at lower than T_CASE 85°C, 3.9us at 85°C < T_CASE≤ 95°C
• Serial presence detect with EEPROM
• DDR2 SDRAM Package: 60ball FBGA - 64Mx4/32Mx8
• All of Lead-free products are compliant for RoHS
Note : For detailed DDR2 SDRAM operation, please refer to Samsung’s Device operation & Timing diagram.