Features: • Established reliability, R failure rate level• High purity alumina substrate for high power• Wraparound termination featuring a tenacious adhesionlayer covered with an electroplated nickel barrier layer for+ 150°C operating conditions• Very low noise and volta...
M55342/02: Features: • Established reliability, R failure rate level• High purity alumina substrate for high power• Wraparound termination featuring a tenacious adhesionlayer covered with a...
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Standard Card Edge Connectors CONNDIN 41612 F96POS 2.54MM SOLDER ST
| STANDARD ELECTRICAL SPECIFICATIONS | ||
| TEST |
SPECIFICATIONS |
CONDITIONS |
| MATERIAL |
TAMELOX® |
|
| Absolute TCR: |
± 25ppm to ± 100ppm |
- 55 to + 125 |
| Absolute Tolerance: |
± 0.1% |
+ 25°C |
| Stability: R Absolute |
± 0.1% |
2000 hrs. @ + 70 |
| Voltage Coefficient |
± 0.5ppm/Volt |
|
| Operating Temperature Range |
- 55 to + 125 |
|
| Storage Temperature Range |
- 55 to + 150 |
|
| Noise |
- 25dB |
|
| Shelf Life Stability |
100ppm |
1 year @ + 25 |
Thin Film Mil chip resistors M55342/02 feature all sputtered wraparoundtermination for excellent adhesion and dimensional uniformity.They are ideal in applications requiring stringent performancerequirements. Established reliability is assured through 100%screening and extensive environmental lot testing. Wafer issawed producing exact dimensions and clean, straight edges.NOTE: Specificationchanged by DSCC from MIL-R-55342to MIL-PRF-55342.