MAX1886

V_CC to GND...........................................................-0.3V to +14V
FB-, FB+, OUT to GND.................................-0.3V to (V_CC + 0.3V)
Continuous Power Dissipation (T_A = +70)
5-Pin Thin SOT23 (derate 7.1mW above +70)..........727mW
Operating Temperature Range ...........................-40 to +85
Junction Temperature......................................................+150
Storage Temperature Range .............................-65 to +150
This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board level solder attach and rework. Maxim recommends the use of the solder profiles recommended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow processes. Preheating, per this standard, is required. Hand or wave soldering is not recommended.
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.