MAX1947

BATT, OUT, SHDN to GND .......................................-0.3V to +4.0V
RESET to GND.............................................-0.3V to (VOUT + 0.3V)
PGND to GND ..........................................................-0.3V to +0.3V
Switch Current (ILX, IOUT, IPGND) (Note 1) .................-1A to +1A
Continuous Power Dissipation (T_A = +70°C)
    8-Pin TDFN (derate 24.4mW/°C above +70°C)........1951.2mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature........................................................+150°C
Storage Temperature Range ............................-65°C to +150°C
Lead Temperature (soldering, 10s) ..................................+300°C

Note 1: LX has internal clamp diodes to PGND and OUT. Applications that forward bias these diodes should take care not to exceed the IC's package power-dissipation limits.

Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.