MAX3013

(All voltages referenced to GND.)
V_CC.........................................................................-0.3V to +4V
V_L...........................................................................-0.3V to +4V
I/O V_CC ....................................................-0.3V to (V_CC + 0.3V)
I/O V_L..........................................................-0.3V to (V_L + 0.3V)
EN ..............................................................-0.3V to (V_L + 0.3V)
Short-Circuit Duration I/O V_L, I/O V_CC to GND..........Continuous
Continuous Power Dissipation (T_A = +70°C)
20-Pin TSSOP (derate 11mW/°C above +70°C) ..........879mW
5 x 4 UCSP (derate 10mW/°C above +70°C) ..............800mW
20-Pin QFN (derate 20.0mW/°C above +70°C) .............1.60W
Operating Temperature Range .......................-40°C to +85°C
Junction Temperature....................................................+150°C
Storage Temperature Range .........................-65°C to +150°C
Lead Temperature (soldering, 10s) ...............................+300°C
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.