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Description: The MAX3205E/MAX3207E/MAX3208E low-capacitance, ±15kV ESD-protection diode arrays with an integrated transient voltage ...


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MAX3208E General Description


The MAX3205E/MAX3207E/MAX3208E low-capacitance, ±15kV ESD-protection diode arrays with an integrated transient voltage suppressor (TVS) clamp are suitable for high-speed and general-signal ESD protection.

Low input capacitance makes these devices ideal for ESD protection of signals in HDTV, PC monitors (DVI™, HDMI™), PC peripherals (FireWire®, USB 2.0), server interconnect (PCI Express™, Infiniband®), datacom, and interchassis interconnect. Each channel consists of a pair of diodes that steer ESD current pulses to VCC or GND.

The MAX3205E/MAX3207E/MAX3208E protect against ESD pulses up to ±15kV Human Body Model, ±8kV Contact Discharge, and ±15kV Air-Gap Discharge, as specified in IEC 61000-4-2. An integrated TVS ensures that the voltage rise seen on VCC during an ESD event is clamped to a known voltage. These devices have a 2pF input capacitance per channel, and a channel-tochannel capacitance variation of only 0.05pF, making them ideal for use on high-speed, single-ended, or differential signals.

The MAX3207E is a two-channel device suitable for USB 1.1, USB 2.0 (480Mbps), and USB OTG applications. The MAX3208E is a four-channel device for Ethernet and FireWire applications. The MAX3205E is a six-channel device for cell phone connectors and SVGA video connections.

The MAX3205E is available in 9-bump, tiny chip-scale (UCSP™), and 16-pin, 3mm x 3mm, thin QFN packages. The MAX3207E is available in a small 6-pin SOT23 package. The MAX3208E is available in 10-pin µMAX® and 16-pin, 3mm x 3mm TQFN packages. All devices are specified for the -40 to +125 automotive operating temperature range.

MAX3208E Maximum Ratings

VCC to GND.............................................................-0.3V to +6.0V
I/O_ to GND..................................................-0.3V to (VCC + 0.3V)
Continuous Power Dissipation (TA = +70)
6-Pin SOT23 (derate 8.7mW/ above +70)...................696mW
9-Pin UCSP (derate 4.7mW/ above +70) ....................379mW
10-Pin µMAX (derate 5.6mW/ above +70) ..................444mW
16-Pin Thin QFN (derate 20.8mW/°C above +70) ......1667mW
Operating Temperature Range ............................-40 to +125
Storage Temperature Range ...............................-65 to +150
Junction Temperature .......................................................+150
Lead Temperature (soldering, 10s) ...................................+300
Bump Temperature (soldering)
Infrared (15s) ...................................................................+220
Vapor Phase (60s) ............................................................+215

MAX3208E Features

`Low Input Capacitance of 2pF Typical
`Low Channel-to-Channel Variation of 0.05pF from I/O to I/O
`High-Speed Differential or Single-Ended ESD Protection
         ±15kVHuman Body Model
         ±8kVIEC 61000-4-2, Contact Discharge
         ±15kVIEC 61000-4-2, Air-Gap Discharge
`Integrated Transient Voltage Suppressor (TVS) Optimized Pinout for Minimized `Stub Instances on Controlled-Impedance Differential-Transmission Line Routing
`-40 to +125 Automotive Operating Temperature Range
`UCSP Packaging Available

MAX3208E Typical Application

·DVI Input/Output Protection
·Set-Top Boxes
·PDAs/Cell Phones
·Graphics Controller Cards
·Displays/Projectors
·High-Speed, Full-Speed and Low-Speed USB
·Port Protection
·FireWire IEEE 1394 Ports
·Consumer Equipment
·High-Speed Differential Signal Protection

MAX3208E Connection Diagram

MAX3208E  Connection Diagram

MAX3208E datasheet

MAX3208E
PDF/DataSheet Download

  • Datasheet: MAX3208E
  • File Size: 310790 KB
  • Manufacturer: MAXIM [Maxim Integrated Products]
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