MAX3228

V_CC to GND...........................................................-0.3V to +6.0V
V+ to GND ............................................................-0.3V to +7.0V
V- to GND .............................................................+0.3V to -7.0V
V+ to |V-| (Note 1) ..............................................................+13V
VL to GND..............................................................-0.3V to +6.0V
Input Voltages
T_IN, FORCEON, FORCEOFF to GND..............-0.3V to (V_L + 0.3V)
R_IN to GND ......................................................................±25V
Output Voltages
T_OUT to GND ................................................................±13.2V
R_OUT to GND..............................................-0.3V to (V_L + 0.3V)
INVALID to GND.........................................-0.3V to (V_CC + 0.3V)
Short-Circuit Duration T_OUT to GND........................Continuous
Continuous Power Dissipation (T_A = +70°C)
6 × 5 UCSP (derate 10.1mW/°C above T_A = +70°C)...805mW
Operating Temperature Range .......................-40°C to +85°C
Junction Temperature...................................................+150°C
Storage Temperature Range ........................-65°C to +150°C
Bump Temperature (Soldering) (Note 2)
Infrared (15s) ...............................................................+200°C
Vapor Phase (20s) .......................................................+215°C
Note 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.
Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recommended
in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow. Preheating
is required. Hand or wave soldering is not allowed.