Purchase MAX3229E, In-stock MAX3229E From SeekIC.
Part Number: MAX3229E
Description: The MAX3228E/MAX3229E are +2.5V to +5.5V powered EIA/TIA-232 and V.28/V.24 communic...
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MAX3229E
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DataSheet
General Description
MAX3229E General Description
The MAX3228E/MAX3229E are +2.5V to +5.5V powered EIA/TIA-232 and V.28/V.24 communications interfaces with low power requirements, high data-rate capabilities, and enhanced electrostatic discharge (ESD) protection, in a chip-scale package (UCSP™ All transmitter outputs and receiver inputs are protected to ±15kV using IEC 1000-4-2 Air-Gap Discharge, ±8kV using IEC 1000-4-2 Contact Discharge, and ±15kV using the Human Body Model. The MAX3228E/MAX3229E achieve a 1µA supply current with Maxim's AutoShutdown™ feature. They save power without changes to existing BIOS or operating systems by entering low-power shutdown mode when the RS-232 cable is disconnected, or when the transmitters of the connected peripherals are off.
The transceivers have a proprietary low-dropout transmitter output stage, delivering RS-232 compliant performance from a +3.1V to +5.5V supply, and RS-232 compatible performance with a supply voltage as low as +2.5V. The dual charge pump requires only four small 0.1µF capacitors for operation from a +3.0V supply. Each device is guaranteed to run at data rates of 250kbps while maintaining RS-232 output levels.
The MAX3228E/MAX3229E offer a separate power-supply input for the logic interface, allowing configurable logic levels on the receiver outputs and transmitter inputs. Operating over a +1.65V to VCC range, VL provides the MAX3228E/MAX3229E compatibility with multiple logic families.
The MAX3229E contains one receiver and one transmitter. The MAX3228E contains two receivers and two transmitters. The MAX3228E/MAX3229E are available in tiny chip-scale packaging and are specified across the extended industrial temperature range of -40°C to
MAX3229E Maximum Ratings
VCC to GND...........................................................-0.3V to +6.0V
V+ to GND ............................................................-0.3V to +7.0V
V- to GND .............................................................+0.3V to -7.0V
V+ to |V-| (Note 1) ..............................................................+13V
VL to GND..............................................................-0.3V to +6.0V
Input Voltages
T_IN_, FORCEON, FORCEOFF to GND.....-0.3V to (VL + 0.3V)
R_IN_ to GND ....................................................................±25V
Output Voltages
T_OUT to GND ................................................................±13.2V
R_OUT INVALID to GND ...............................-0.3V to (VL + 0.3V)
INVALID to GND..........................................-0.3V to (VCC +0.3V)
Short-Circuit Duration T_OUT to GND........................Continuous
Continuous Power Dissipation (TA = +70°C)
6 * 5 UCSP (derate 10.1mW/°C above TA = +70°C)...805mW
Operating Temperature Range .......................-40°C to +85°C
Junction Temperature....................................................+150°C
Storage Temperature Range .........................-65°C to +150°C
Bump Temperature (Soldering) (Note 2)
Infrared (15s) ...............................................................+200°C
Vapor Phase (20s) ........................................................+215°C
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.
Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recommended
in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow. Preheating
is required. Hand or wave soldering is not allowed.
MAX3229E Features
`6 * 5 Chip-Scale Packaging (UCSP)
`ESD Protection for RS-232 I/O Pins:
±15kV-IEC 1000-4-2 Air-Gap Discharge
±8kV-IEC 1000-4-2 Contact Discharge
±15kV-Human Body Model
`1µA Low-Power AutoShutdown
`250kbps Guaranteed Data Rate
`Meets EIA/TIA-232 Specifications Down to +3.1V
`RS-232 Compatible to +2.5V Allows Operation from Single Li+ Cell
`Small 0.1µF Capacitors
`Configurable Logic Levels
`ESD Protection for RS-232 I/O Pins:
±15kV-IEC 1000-4-2 Air-Gap Discharge
±8kV-IEC 1000-4-2 Contact Discharge
±15kV-Human Body Model
`1µA Low-Power AutoShutdown
`250kbps Guaranteed Data Rate
`Meets EIA/TIA-232 Specifications Down to +3.1V
`RS-232 Compatible to +2.5V Allows Operation from Single Li+ Cell
`Small 0.1µF Capacitors
`Configurable Logic Levels
MAX3229E Typical Application
·Personal Digital Assistants
·Cell Phone Data Lump Cables
·Set-Top Boxes
·Hand-Held Devices
·Cell Phones
·Cell Phone Data Lump Cables
·Set-Top Boxes
·Hand-Held Devices
·Cell Phones
MAX3229E
PDF/DataSheet Download
- Datasheet: MAX3229E
- File Size: 258031 KB
- Manufacturer: Maxim
- Click here to Download
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