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Part Number: MAX3273
Description: The MAX3273 is a compact, low-power laser driver for applications up to 2.7Gbps. The device uses a sin...


Description: The MAX3273 is a compact, low-power laser driver for applications up to 2.7Gbps. The device uses a sin...
The MAX3273 is a compact, low-power laser driver for applications up to 2.7Gbps. The device uses a single +3.3V supply and typically consumes 30mA. The bias and modulation current levels are programmed by external resistors. An automatic power-control (APC) loop is incorporated to maintain a constant average optical power over temperature and lifetime. The laser driver is fabricated using Maxim's in-house, secondgeneration SiGe process.
The MAX3273 accepts differential CML-compatible clock and data input signals. Inputs are self-biased to allow AC-coupling. An input data-retiming latch can be enabled to reject input jitter if a clock signal is available.
The driver can provide bias current up to 100mA and modulation current up to 60mAP-P with typical (20% to 80%) edge speeds of 59ps. A failure-monitor output is provided to indicate when the APC loop is unable to maintain average optical power. The MAX3273 is available in a 4mm * 4mm, 24-pin QFN package, as well as in die form.
Supply Voltage, VCC.............................................-0.5V to +6.0V
Current into BIAS, OUT+, OUT- ......................-20mA to +150mA
Current into MD....................................................-5mA to +5mA
Voltage at DATA+, DATA-, CLK+
CLK-, LATCH, EN, FAIL...............................-0.5V to (VCC + 0.5V)
Voltage at MODSET, BIASMAX,
APCSET, APCFILT1, APCFILT2..............................-0.5V to +3.0V
Voltage at BIAS .......................................+1.0V to (VCC + 1.5V)
Voltage at OUT+, OUT-.............................+1.5V to (VCC + 1.5V)
Current into FAIL .............................................-10mA to +10mA
Continuous Power Dissipation (TA = +85°C)
24-Pin QFN (derate 274mW/°C above +85°C) ..........1781mW
Storage Temperature Range ........................-55°C to +150°C
Operating Junction Temperature ..................-55°C to +150°C
Die Attach Temperature (die) .......................................+400°C
Lead Temperature (soldering, 10s) ..............................+300°C
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
MAX3273
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