MAX3867

Supply Voltage, V_CC............................................ -0.5V to +7.0V
Current into BIAS ...........................................-20mA to +150mA
Current into OUT+, OUT- ................................-20mA to +100mA
Current into MD.....................................................-5mA to +5mA
Voltage at DATA+, DATA-, CLK+, CLK-,
ENABLE, LATCH, FAIL, SLWSTRT..................-0.5V to (V_CC + 0.5V)
Voltage at APCFILT, CAPC, MODSET,
BIASMAX, APCSET ................................................-0.5V to +3.0V
Voltage at OUT+, OUT-..............................+1.5V to (V_CC + 1.5V)
Voltage at BIAS .........................................+1.0V to (V_CC + 0.5V)
Current into FAIL ...............................................-10mA to +30mA
Continuous Power Dissipation (T_A = +85°C)
TQFP (derate 20.8mW/°C above +85°C)......................1354mW
Storage Temperature Range ...........................-65°C to +165°C
Operating Junction Temperature Range...........-55°C to +150°C
Processing Temperature (die) .........................................+400°C
Lead Temperature (soldering, 10sec) .............................+300°C
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.