MAX4369

V_CC to GND.............................................................-0.3V to +6V
All Other Pins to GND.................................-0.3V to (V_CC + 0.3V)
Output Short Circuit to V_CC or GND (Note 1)............Continuous
Continuous Power Dissipation (T_A = +70°C)
9-Bump USCP (derate 4.7mW/°C above +70°C).........379mW
Operating Temperature Range ......................-40°C to +85°C
Junction Temperature...................................................+150°C
Storage Temperature Range .......................-65°C to +150°C
Bump Temperature (soldering) (Note 2)
Infrared (15s) ..............................................................+220°C
Vapor Phase (60s) .......................................................+215°C

Note 1: Continuous power dissipation must also be observed.
Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile that the device can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recommended in the industry standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow. Preheating is required. Hand or wave soldering is not allowed.

Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.