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MFG:MAXIM D/C:06+
Part Number: MAX4410
MFG: MAXIM
D/C: 06+
Description: The MAX4410 stereo headphone driver is designed for portable equipment where board space is at a premi...
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MAX4410
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DataSheet
General Description
MAX4410 General Description
The MAX4410 stereo headphone driver is designed for portable equipment where board space is at a premium. The MAX4410 uses a unique, patented, DirectDrive architecture to produce a ground-referenced output from a single supply, eliminating the need for large DC-blocking capacitors, saving cost, board space, and component height.
The MAX4410 delivers up to 80mW per channel into a 16Ω load and has low 0.003% THD + N. A high powersupply rejection ratio (90dB at 1kHz) allows this device to operate from noisy digital supplies without an additional linear regulator. The MAX4410 includes ±8kV ESD protection on the headphone outputs. Comprehensive clickand- pop circuitry suppresses audible clicks and pops on startup and shutdown. Independent left/right, low-power shutdown controls make it possible to optimize power savings in mixed mode, mono/stereo applications.
The MAX4410 operates from a single 1.8V to 3.6V supply, consumes only 7mA of supply current, has short-circuit and thermal overload protection, and is specified over the extended -40°C to +85°C temperature range. The MAX4410 is available in a tiny (2mm x 2mm x 0.6mm), 16-bump chip-scale package (UCSP™) and a 14-pin TSSOP package.
MAX4410 Maximum Ratings
PGND to SGND .....................................................-0.3V to +0.3V
PVDD to SVDD .......................................................-0.3V to +0.3V
PVSS to SVSS ........................................................-0.3V to +0.3V
PVDD and SVDD to PGND or SGND ...........................-0.3V to +4V
PVSS and SVSS to PGND or SGND ............................-4V to +0.3V
IN_ to SGND .........................................................-0.3V to +0.3V
SHDN_ to SGND...........................(SGND - 0.3V) to (SVDD + 0.3V)
OUT_ to SGND ..............................(SVSS - 0.3V) to (SVDD + 0.3V)
C1P to PGND................................(PGND - 0.3V) to (PVDD + 0.3V)
C1N to PGND ...............................(PVSS - 0.3V) to (PGND + 0.3V)
Output Short Circuit to GND or VDD............................Continuous
Continuous Power Dissipation (TA = +70°C)
14-Pin TSSOP (derate 9.1mW/°C above +70°C) ...........727mW
16-Bump UCSP (derate 15.2mW/°C above +70°C)......1212mW
Junction Temperature......................................................+150°C
Operating Temperature Range .........................-40°C to +85°C
Storage Temperature Range ..........................-65°C to +150°C
Bump Temperature (soldering) (Note 1)
Infrared (15s) ................................................................+220°C
Vapor Phase (60s) .........................................................+215°C
Lead Temperature (soldering, 10s) ...............................+300°C
PVDD to SVDD .......................................................-0.3V to +0.3V
PVSS to SVSS ........................................................-0.3V to +0.3V
PVDD and SVDD to PGND or SGND ...........................-0.3V to +4V
PVSS and SVSS to PGND or SGND ............................-4V to +0.3V
IN_ to SGND .........................................................-0.3V to +0.3V
SHDN_ to SGND...........................(SGND - 0.3V) to (SVDD + 0.3V)
OUT_ to SGND ..............................(SVSS - 0.3V) to (SVDD + 0.3V)
C1P to PGND................................(PGND - 0.3V) to (PVDD + 0.3V)
C1N to PGND ...............................(PVSS - 0.3V) to (PGND + 0.3V)
Output Short Circuit to GND or VDD............................Continuous
Continuous Power Dissipation (TA = +70°C)
14-Pin TSSOP (derate 9.1mW/°C above +70°C) ...........727mW
16-Bump UCSP (derate 15.2mW/°C above +70°C)......1212mW
Junction Temperature......................................................+150°C
Operating Temperature Range .........................-40°C to +85°C
Storage Temperature Range ..........................-65°C to +150°C
Bump Temperature (soldering) (Note 1)
Infrared (15s) ................................................................+220°C
Vapor Phase (60s) .........................................................+215°C
Lead Temperature (soldering, 10s) ...............................+300°C
MAX4410 Features
No Bulky DC-Blocking Capacitors Required
Ground-Referenced Outputs Eliminate DC-Bias Voltages on Headphone Ground Pin
No Degradation of Low-Frequency Response Due to Output Capacitors
80mW Per Channel into 16Ω
Low 0.003% THD + N
High PSRR (90dB at 1kHz)
Integrated Click-and-Pop Suppression
1.8V to 3.6V Single-Supply Operation
Low Quiescent Current
Independent Left/Right, Low-Power Shutdown Controls
Short-Circuit and Thermal Overload Protection
±8kV ESD-Protected Amplifier Outputs
Available in Space-Saving Packages
16-Bump UCSP (2mm x 2mm x 0.6mm)
14-Pin TSSOP
Ground-Referenced Outputs Eliminate DC-Bias Voltages on Headphone Ground Pin
No Degradation of Low-Frequency Response Due to Output Capacitors
80mW Per Channel into 16Ω
Low 0.003% THD + N
High PSRR (90dB at 1kHz)
Integrated Click-and-Pop Suppression
1.8V to 3.6V Single-Supply Operation
Low Quiescent Current
Independent Left/Right, Low-Power Shutdown Controls
Short-Circuit and Thermal Overload Protection
±8kV ESD-Protected Amplifier Outputs
Available in Space-Saving Packages
16-Bump UCSP (2mm x 2mm x 0.6mm)
14-Pin TSSOP
MAX4410 Typical Application
Notebooks MP3 Players
Cellular Phones Web Pads
PDAs Portable Audio Equipment
Cellular Phones Web Pads
PDAs Portable Audio Equipment
MAX4410 Connection Diagram
MAX4410
PDF/DataSheet Download
- Datasheet: MAX4410
- File Size: 886271 KB
- Manufacturer: MAXIM [Maxim Integrated Products]
- Click here to Download
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