Purchase MAX4411, In-stock MAX4411 From SeekIC.
Part Number: MAX4411
Description: The MAX4411 fixed-gain, stereo headphone amplifier is designed for portable equipment where board space is at a premium...
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MAX4411
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DataSheet
General Description
MAX4411 General Description
The MAX4411 fixed-gain, stereo headphone amplifier is designed for portable equipment where board space is at a premium. The MAX4411 uses a unique, patented DirectDrive architecture to produce a ground-refer- enced output from a single supply, eliminating the need for large DC-blocking capacitors, saving cost, board space, and component height. Additionally, the gain of the amplifier is set internally (-1.5V/V, MAX4411 and -2V/V, MAX4411B), further reducing component count.
The MAX4411 delivers up to 80mW per channel into a 16Ω load and has low 0.003% THD+N. An 86dB at 217Hz power-supply rejection ratio (PSRR) allows this device to operate from noisy digital supplies without an additional linear regulator. The MAX4411 includes ±8kV ESD protection on the headphone outputs. Com- prehensive click-and pop circuitry suppresses audible clicks and pops on startup and shutdown. Independent left/right, low-power shutdown controls make it possible to optimize power savings in mixed-mode, mono/stereo applications.
The MAX4411 operates from a single 1.8V to 3.6V supply, consumes only 5mA of supply current, has short-circuit and thermal-overload protection, and is specified over the extended -40°C to +85°C temperature range. The MAX4411 is available in a tiny (2mm ✕ 2mm ✕ 0.6mm), 16-bump chip-scale package (UCSP™) and a 20-pin thin QFN package (4mm ✕ 4mm ✕ 0.8mm).
MAX4411 Maximum Ratings
PGND to SGND .....................................................-0.3V to +0.3V
PVDD to SVDD .................................................................-0.3V to +0.3V
PVSS to SVSS .........................................................-0.3V to +0.3V
PVDD and SVDD to PGND or SGND.........................-0.3V to +4V
PVSS and SVSS to PGND or SGND ..........................-4V to +0.3V
IN_ to SGND ................................(SVSS - 0.3V) to (SVDD + 0.3V)
SHDN_ to SGND........................(SGND - 0.3V) to (SVDD + 0.3V)
OUT_ to SGND .............................(SVSS - 0.3V) to (SVDD +0.3V)
C1P to PGND.............................(PGND - 0.3V) to (PVDD + 0.3V)
C1N to PGND.............................(PVSS - 0.3V) to (PGND + 0.3V)
Output Short Circuit to GND or VDD...........................Continuous
Continuous Power Dissipation (TA = +70°C)
16-Bump UCSP (derate 7.4mW/°C above +70°C)........589mW
20-Pin Thin QFN (derate 16.9mW/°C above +70°C) ..1349mW
Junction Temperature......................................................+150°C
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Bump Temperature (soldering)
Reflow ..........................................................................+230°C
Lead Temperature (soldering, 10s) .................................+300°C
PVDD to SVDD .................................................................-0.3V to +0.3V
PVSS to SVSS .........................................................-0.3V to +0.3V
PVDD and SVDD to PGND or SGND.........................-0.3V to +4V
PVSS and SVSS to PGND or SGND ..........................-4V to +0.3V
IN_ to SGND ................................(SVSS - 0.3V) to (SVDD + 0.3V)
SHDN_ to SGND........................(SGND - 0.3V) to (SVDD + 0.3V)
OUT_ to SGND .............................(SVSS - 0.3V) to (SVDD +0.3V)
C1P to PGND.............................(PGND - 0.3V) to (PVDD + 0.3V)
C1N to PGND.............................(PVSS - 0.3V) to (PGND + 0.3V)
Output Short Circuit to GND or VDD...........................Continuous
Continuous Power Dissipation (TA = +70°C)
16-Bump UCSP (derate 7.4mW/°C above +70°C)........589mW
20-Pin Thin QFN (derate 16.9mW/°C above +70°C) ..1349mW
Junction Temperature......................................................+150°C
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Bump Temperature (soldering)
Reflow ..........................................................................+230°C
Lead Temperature (soldering, 10s) .................................+300°C
MAX4411 Features
No Bulky DC-Blocking Capacitors Required
Fixed -1.5V/V Gain Eliminates External Feedback
Network
MAX4411: -1.5V/V
MAX4411B: -2V/V
Ground-Referenced Outputs Eliminate DC-Bias Voltages on Headphone Ground Pin
No Degradation of Low-Frequency Response Due to Output Capacitors
80mW per Channel into 16Ω
Low 0.003% THD+N
High PSRR (86dB at 217Hz)
Integrated Click-and-Pop Suppression
1.8V to 3.6V Single-Supply Operation
Low Quiescent Current (5mA)
Independent Left/Right, Low-Power
Shutdown Controls
Short-Circuit and Thermal-Overload Protection
±8kV ESD-Protected Amplifier Outputs
Available in Space-Saving Packages
16-Bump UCSP (2mm ✕ 2mm ✕ 0.6mm)
20-Pin Thin QFN (4mm ✕ 4mm ✕ 0.8mm)
Fixed -1.5V/V Gain Eliminates External Feedback
Network
MAX4411: -1.5V/V
MAX4411B: -2V/V
Ground-Referenced Outputs Eliminate DC-Bias Voltages on Headphone Ground Pin
No Degradation of Low-Frequency Response Due to Output Capacitors
80mW per Channel into 16Ω
Low 0.003% THD+N
High PSRR (86dB at 217Hz)
Integrated Click-and-Pop Suppression
1.8V to 3.6V Single-Supply Operation
Low Quiescent Current (5mA)
Independent Left/Right, Low-Power
Shutdown Controls
Short-Circuit and Thermal-Overload Protection
±8kV ESD-Protected Amplifier Outputs
Available in Space-Saving Packages
16-Bump UCSP (2mm ✕ 2mm ✕ 0.6mm)
20-Pin Thin QFN (4mm ✕ 4mm ✕ 0.8mm)
MAX4411 Typical Application
Notebook PCs
Cellular Phones
PDAs
MP3 Players
Smart Phones
Portable Audio Equipment
Cellular Phones
PDAs
MP3 Players
Smart Phones
Portable Audio Equipment
MAX4411 Connection Diagram
MAX4411
PDF/DataSheet Download
- Datasheet: MAX4411
- File Size: 638113 KB
- Manufacturer: MAXIM [Maxim Integrated Products]
- Click here to Download
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