MAX5159

V_DD to AGND........................................................-0.3V to +6V
V_DD to DGND .......................................................-0.3V to +6V
AGND to DGND...............................................................±0.3V
OSA, OSB to AGND........................(AGND - 4V) to (V_DD + 0.3V)
REF_, OUT_ to AGND...............................-0.3V to (V_DD + 0.3V)
Digital Inputs (SCLK, DIN, CS, CL, PDL)
to DGND.............................................................(-0.3V to +6V)
Digital Outputs (DOUT, UPO)
to DGND..................................................-0.3V to (V_DD + 0.3V)
Maximum Current into Any Pin .....................................±20mA
Continuous Power Dissipation (TA = +70°C)
Plastic DIP (derate 10.5mW/°C above +70°C) ..........842mW
QSOP (derate 8.30mW/°C above +70°C)...................667mW
CERDIP (derate 10.00mW/°C above +70°C)..............800mW
Operating Temperature Ranges
MAX515_ _C_ E ................................................0°C to +70°C
MAX515_ _E_ E .............................................-40C° to +85°C
MAX515_ _MJE.............................................-55°C to +125°C
Storage Temperature Range .......................-65°C to +160°C
Lead Temperature (soldering, 10sec) .........................+300°C
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.