MAX5294

The MAX5294 belongs to MAX5290MAX5295 dual, 12-/10-/8-bit, voltageoutput digital-to-analog converters (DACs)offer buffered outputs and a 3s maximum settling time at the 12-bit level. The MAX5290/MAX5291 are 12-bit DACs, the MAX5292/ MAX5293 are 10-bit DACs, and the MAX5294/MAX5295 are 8-bit DACs. The MAX5290/ MAX5292/MAX5294 provide unity-gain-configured output buffers, while the MAX5291/MAX5293/MAX5295 provide force-sense-configured output buffers. The DACs operate from a 2.7V to 5.25V analog supply and a separate 1.8V to 3.6V digital supply. The 20MHz 3-wire serial interface is compatible with SPI?, QSPI?, MICROWIRE?, and digital signal processor (DSP)protocol applications. The MAX5290MAX5295 are specified over the extended -40°C to +85°C temperature range, and are available in space-saving 4mm x 4mm, 16-pin thin QFN and 6.5mm x 5mm, 14-pin and 16-pin TSSOP packages. Multiple devices can share a common serial interface in direct access or daisy-chained configuration. The MAX5290MAX5295 provide two multifunctional, user-programmable, digital I/O ports. The externally selectable power-up states of the DAC outputs are either zero scale, midscale, or full scale. Software-selectable FAST and SLOW settling modes decrease settling time in FAST mode, or reduce supply current in SLOW mode.

The features of MAX5294 can be summarized as (1)dual, 12-/10-/8-Bit serial DACs in 4mm x 4mm thin QFN and TSSOP Packages; (2)3s (max)12-Bit settling time to 1/2 LSB; (3)integral nonlinearity 1 LSB (max)MAX5290/MAX5291 A-Grade (12-Bit)/ 1 LSB (max)MAX5292/MAX5293 (10-Bit)/ 1/2 LSB (max)MAX5294/MAX5295 (8-Bit); (4)guaranteed monotonic, ±1 LSB (max)DNL; (5)two user-programmable digital I/O Ports; (6)single +2.7V to +5.25V analog supply; (7)+1.8V to AVDD digital supply; (8)20MHz 3-Wire SPI-/QSPI-/MICROWIREand DSP-compatible serial interface; (9)glitch-free outputs power up to zero scale, midscale or full scale; (10)unity-gainor force-sense-configured output buffers.

The absolute maximum ratings of MAX5294 are (1)AVDD to DVDD:±6V; (2)AGND to DGND: ±0.3V; (3)AVDD to AGND, DGND: -0.3V to +6V; (4)DVDD to AGND, DGND: -0.3V to +6V; (5)FB_, OUT_, REF to AGND:-0.3V to the lower of (AVDD + 0.3V)or +6V; (6)SCLK, DIN, CS, PU, DSP to DGND: -0.3V to the lower of (DVDD + 0.3V)or +6V; (7)UPIO1, UPIO2 to DGND: -0.3V to the lower of (DVDD + 0.3V)or +6V; (8)maximum current into any pin: ±50mA; (9)continuous power dissipation (TA = +70°C)14-Pin TSSOP (derate 9.1mW/°C above +70°C): 727mW/ 16-Pin TSSOP (derate 9.4mW/°C above +70°C): 755mW/ 16-Pin Thin QFN (derate 16.9mW/°C above +70°C): 1349mW; (10)operating temperature range: -40°C to +85°C; (11)storage temperature range: -65°C to +150°C; (12)maximum junction temperature: +150°C; (13)lead temperature (soldering, 10s): +300°C.