MAX8504

ABSOLUTE MAXIMUM RATINGS
BATTP, BATT, OUT, SHDN, SKIP, HP,
REFIN, FB to GND ....................................................-0.3V to +6V
PGND to GND .......................................................-0.3V to +0.3V
REF, COMP to GND .................................-0.3V to (VBATT + 0.3V)
LX Current (Note 1) ...........................................................2.25A
Output Short-Circuit Duration .......................................Indefinite
Continuous Power Dissipation (TA = +70°C)
12-Lead Thin QFN (derate 16.9mW/°C above +70°C) .1349mW
Operating Temperature Range .........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range ...........................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C

Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Note 1: LX has internal clamp diodes to PGND and BATTP. Applications that forward bias these diodes should take care not to exceed the IC's package power dissipation limits.