MAX8521

ABSOLUTE MAXIMUM RATINGS
VDD to GND.........................................................-0.3V to +6V
SHDN, MAXV, MAXIP, MAXIN
CTLI to GND.........................................................-0.3V to +6V
COMP, FREQ, OS1, OS2, CS, REF,
ITEC to GND...........................................-0.3V to (VDD + 0.3V)
PVDD1, PVDD2 to GND.........................-0.3V to (VDD + 0.3V)
PVDD1, PVDD2 to VDD ....................................-0.3V to +0.3V
PGND1, PGND2 to GND .......................................-0.3V to +0.3V
COMP, REF, ITEC Short to GND ..................................Indefinite
LX Current (Note 1) ....................................±2.25A LX Current
Continuous Power Dissipation (TA = +70°C)
20-Pin 5mm x 5mm x 0.9mm QFN (derate 20.8mW/°C
above +70°C) (Note 2)...................................................1.67W
3mm x 3mm UCSP (derate 22mW/°C
above +70°C).................................................................1.75W
Maximum Junction Temperature ....................................+150°C
Storage Temperature Range .........................-65°C to +150°C
Lead Temperature (soldering 10s) ................................+300°C

Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating  onditions for extended periods may affect device reliability.

Note 1: LX has internal clamp diodes to PGND and PVDD. Applications that forward bias these diodes should take care not to exceed the IC's package power dissipation limits.


Note 2: Solder underside metal slug to PC board ground plane.