MAX8707

V_CC to GND...........................................................-0.3V to +6V
D0D4 to GND......................................................-0.3V to +6V
SKIP, SUS, VROK, ILIM(AVE) to GND......................-0.3V to +6V
SUSV, OFS, OSC to GND........................................-0.3V to +6V
CSP_, CSN_, CRSP, CRSN to GND .........................-0.3V to +6V
VPS, FBS, CCV, REF to GND .....................-0.3V to (V_CC + 0.3V)
ILIM(PK), TRC, TIME to GND .....................-0.3V to (V_CC + 0.3V)
PWM_, DRSKP to PGND ............................-0.3V to (V_CC + 0.3V)
PGND, GNDS to GND ...........................................-0.3V to +0.3V
SHDN to GND (Note 1)..........................................-0.3V to +14V
REF Short-Circuit Duration .......................................Continuous
Continuous Power Dissipation (T_A = +70°C)
   40-Pin 6mm x 6mm Thin QFN
   (derate 26.3mW/°C above +70°C)...........................2.105W
Operating Temperature Range .......................-40°C to +85°C
Junction Temperature....................................................+150°C
Storage Temperature Range .........................-65°C to +150°C
Lead Temperature (soldering, 10s) ...............................+300°C

Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.