MAX9039

Supply Voltage (V_CC to V_EE) ...................................-0.3V to +6V
All Other Pins ...................................(V_EE - 0.3V) to (V_CC + 0.3V)
Output Short-Circuit Duration
(OUT_, REF) ..................Indefinite Short Circuit to Either Supply
Continuous Power Dissipation (T_A = +70°C)
5-Pin SOT23 (derate 7.10mW/°C above +70°C)..........571mW
6-Bump UCSP (derate 3.9mW/°C above +70°C) .........308mW
6-Pin SOT23 (derate 8.70mW/°C above +70°C)..........696mW
8-Pin SO (derate 5.88mW/°C above +70°C)................471mW
8-Pin MAX (derate 4.1mW/°C above +70°C) .............330mW
10-Pin MAX (derate 5.6mW/°C above +70°C) ...........444mW
Operating Temperature Range ......................-40°C to +85°C
Junction Temperature...................................................+150°C
Storage Temperature Range ........................-65°C to +150°C
Lead Temperature (soldering, 10s) ..............................+300°C
Bump Reflow Temperature (Note 1) ..............................+235°C

Note 1: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recommended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection Packaging Reflow. Preheating is required. Hand or wave soldering is not allowed.

Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.