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Part Number: MAX9312
Description: The MAX9312/MAX9314 are low skew, dual 1-to-5 differential drivers designed for clock and data distrib...


Description: The MAX9312/MAX9314 are low skew, dual 1-to-5 differential drivers designed for clock and data distrib...
The MAX9312/MAX9314 are low skew, dual 1-to-5 differential drivers designed for clock and data distribution.
These devices accept two inputs. Each input is reproduced at five differential outputs. The differential inputs can be adapted to accept single-ended inputs by connecting the on-chip VBB supply to one input as a reference voltage.
The MAX9312/MAX9314 feature low part-to-part skew (30ps) and output-to-output skew (12ps), making them ideal for clock and data distribution across a backplane or a board. For interfacing to differential HSTL and LVPECL signals, these devices operate over a +2.25V to +3.8V supply range, allowing high-performance clock or data distribution in systems with a nominal +2.5V or +3.3V supply. For differential LVECL operation, these devices operate from a -2.25V to -3.8V supply.
The MAX9312 features an on-chip VBB reference output of 1.425V below the positive supply voltage. The MAX9314 offers an on-chip VBB reference output of 1.32V below the positive supply voltage.
Both devices are offered in space-saving, 32-pin 5mm×5mm TQFP, 5mm x 5mm QFN, and industry-standard
32-pin 7mm ✕ 7mm TQFP packages.
VCC - VEE..............................................................................4.1V
Inputs (CLK_, CLK_) ..............................VEE - 0.3V to VCC + 0.3V
CLK_ to CLK_ ....................................................................±3.0V
Continuous Output Current ..............................................50mA
Surge Output Current......................................................100mA
VBB Sink/Source Current .............................................±0.65mA
Junction-to-Ambient Thermal Resistance in Still Air
32-Pin 7mm * 7mm TQFP.............................................+90/W
Junction-to-Ambient Thermal Resistance with
500 LFPM Airflow
32-Pin 7mm *7mm TQFP..............................................+60/W
Junction-to-Case Thermal Resistance
32-Pin 7mm * 7mm TQFP.............................................+12/W
Operating Temperature Range ...........................-40 to +85
Junction Temperature......................................................+150
Storage Temperature Range .............................-65 to +150
ESD Protection
Human Body Model (CLK_, CLK_, Q_, Q_) ............................2kV
Soldering Temperature (10s) ...........................................+300
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
MAX9312
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