MAX9405

V_CC to V_EE............................................................-0.3V to +6V
Inputs to V_EE...........................................-0.3V to (V_CC + 0.3V)
Differential Input Voltage .................................................±3V
Continuous Output Current ...........................................50mA
Surge Output Current...................................................100mA
Continuous Power Dissipation (T_A = +70)
32-Pin 5mm x 5mm TQFP
(derate 9.5mW/ above +70)..................................761mW
32-Lead 5mm x 5mm QFN
(derate 21.3mW/ above +70)...................................1.7W
Junction-to-Ambient Thermal Resistance in Still Air
32-Pin 5mm x 5mm TQFP.........................................+105/W
32-Lead 5mm x 5mm QFN ........................................+47/W
Junction-to-Ambient Thermal Resistance with
500LFPM Airflow
32-Pin 5mm x 5mm TQFP..........................................+73/W
Junction-to-Case Thermal Resistance
32-Pin 5mm x 5mm TQFP..........................................+25/W
32-Lead 5mm x 5mm QFN ..........................................+2/W
Operating Temperature Range .......................-40 to +85
Junction Temperature..................................................+150
Storage Temperature Range .........................-65 to +150
ESD Protection
Human Body Model (Inputs and Outputs) ........................2kV
Soldering Temperature (10s) ......................................+300
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.