MAX9708

PVDD, VDD to PGND, GND ......................................-0.3 to +30V
PVDD to VDD........................................................-0.3V to +0.3V
OUTR+, OUTR-, OUTL+,
OUTL- to PGND, GND................................-0.3V to (PVDD + 0.3V)
C1N to GND .............................................-0.3V to (PVDD + 0.3V)
C1P to GND...............................(PVDD - 0.3V) to (CPVDD + 0.3V)
CPVDD to GND ..........................................(PVDD - 0.3V) to +40V
All Other Pins to GND..............................................-0.3V to +12V
Continuous Input Current (except PVDD, VDD, OUTR+,
OUTR-, OUTL+, and OUTL-) ...............................................20mA
Continuous Power Dissipation (TA = +70°C)
56-Pin Thin QFN (derate 47.6mW/°C above +70°C) ......3.81W
64-Pin TQFP (derate 43.5mW/°C above +70°C).............3.48W
Operating Temperature Range ........................-40°C to +85°C
Storage Temperature Range .........................-65°C to +150°C
Junction Temperature.....................................................+150°C
Thermal Resistance (JC)
56-Pin Thin QFN. .........................................................0.6°C/W
64-Pin TQFP....................................................................2°C/W
Lead Temperature (soldering, 10s) ...............................+300°C

Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.