MAX9758

Supply Voltage (V_DD, PV_DD, HPVDD, CPVDD, IN to GND) ....+6V
PGND, CPGND to GND......................................................±0.3V
CPV_SS, C1N, VSS to GND.....................................-6.0V to +0.3V
HP_ to GND ........................................................................±3V
Any Other Pin ...........................................-0.3V to (V_DD + 0.3V)
Duration of OUT_ Short Circuit to GND or PVDD........Continuous
Duration of OUT_+ Short Circuit to OUT_- ................Continuous
Duration of HP_ Short Circuit to GND,
   V_SS, or HPV_DD.........................................................Continuous
Duration of OUT Short Circuit to GND........................Continuous
Continuous Current (PVDD, OUT_, PGND) ...........................1.7A
Continuous Current (CPVDD, C1N, CPGND, C1P, CPVSS,
   V_SS, HPVDD, HP_, IN, OUT) .............................................0.85A
Continuous Input Current (all other pins) ......................±20mA
Continuous Power Dissipation (T_A = +70°C, single-layer board)
  32-Pin Thin QFN (derate 18.6mW/°C above +70°C)..1490mW
  36-Pin Thin QFN (derate 20.4mW/°C above +70°C)..1633mW
Continuous Power Dissipation (T_A =+70°C, multilayer board)
  32-Pin Thin QFN (derate 24.9mW/°C above +70°C)..1990mW
  36-Pin Thin QFN (derate 27.7mW/°C above +70°C)..2180mW
Junction Temperature .....................................................+150°C
Operating Temperature Range .........................-40°C to +85°C
Storage Temperature Range ...........................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C

Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.